Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges

IF 9.1 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Baoshan Tang, Maheswari Sivan, Jin Feng Leong, Zefeng Xu, Yu Zhang, Jianan Li, Ruyue Wan, Quanzhen Wan, Evgeny Zamburg, Aaron V-Y Thean
{"title":"Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges","authors":"Baoshan Tang, Maheswari Sivan, Jin Feng Leong, Zefeng Xu, Yu Zhang, Jianan Li, Ruyue Wan, Quanzhen Wan, Evgeny Zamburg, Aaron V-Y Thean","doi":"10.1038/s41699-024-00508-2","DOIUrl":null,"url":null,"abstract":"Solution-processable 2D materials (2DMs) are gaining attention for applications in logic, memory, and sensing devices. This review surveys recent advancements in memristors, transistors, and sensors using 2DMs, focusing on their charge transport mechanisms and integration into silicon CMOS platforms. We highlight key challenges posed by the material’s nanosheet morphology and defect dynamics and discuss future potential for monolithic 3D integration with CMOS technology.","PeriodicalId":19227,"journal":{"name":"npj 2D Materials and Applications","volume":" ","pages":"1-30"},"PeriodicalIF":9.1000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s41699-024-00508-2.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"npj 2D Materials and Applications","FirstCategoryId":"88","ListUrlMain":"https://www.nature.com/articles/s41699-024-00508-2","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Solution-processable 2D materials (2DMs) are gaining attention for applications in logic, memory, and sensing devices. This review surveys recent advancements in memristors, transistors, and sensors using 2DMs, focusing on their charge transport mechanisms and integration into silicon CMOS platforms. We highlight key challenges posed by the material’s nanosheet morphology and defect dynamics and discuss future potential for monolithic 3D integration with CMOS technology.

Abstract Image

用于单片式三维存储-传感-计算平台的可溶液加工二维材料:机遇与挑战
溶液可加工二维材料(2DMs)在逻辑、存储器和传感设备中的应用越来越受到关注。这篇综述探讨了使用 2DM 的忆阻器、晶体管和传感器的最新进展,重点是它们的电荷传输机制以及与硅 CMOS 平台的集成。我们强调了这种材料的纳米片形态和缺陷动力学所带来的关键挑战,并讨论了与 CMOS 技术进行单片三维集成的未来潜力。
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来源期刊
npj 2D Materials and Applications
npj 2D Materials and Applications Engineering-Mechanics of Materials
CiteScore
14.50
自引率
2.10%
发文量
80
审稿时长
15 weeks
期刊介绍: npj 2D Materials and Applications publishes papers on the fundamental behavior, synthesis, properties and applications of existing and emerging 2D materials. By selecting papers with the potential for impact, the journal aims to facilitate the transfer of the research of 2D materials into wide-ranging applications.
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