Temperature-sensitive shape memory polyamide elastomers with tunable segments: achieving excellent performances and application prospects

IF 23.2 2区 材料科学 Q1 MATERIALS SCIENCE, COMPOSITES
Chengke Yuan, Yingchun Li, Jianyu Xue, Jia Mi, Yu Wang, Zhexenbek Toktarbay
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Abstract

Thermoplastic polyamide elastomers (TPAEs) possess remarkable characteristics such as high-temperature tolerance, superior mechanical properties, and the shape memory effect (SME). The current study develops a type of TPAE with SME by fabricating the long carbon chain polyamide (PA512) and polyethylene glycol (PEG) through a two-step melt polycondensation process. The properties of TPAEs were investigated by varying the PA512 prepolymer’s molecular weight and the amount of PEG. During synthesizing TPAEs with SME, the crucial balance of COOH and OH groups was skillfully achieved by introducing biobased butanediol (BDO). The chemical structure of TPAEs is confirmed by FTIR and 1H NMR tests. By meticulously engineering the PA512 molecular weight and refining the PEG domain content, TPAEs are fabricated to elongate at a break of 592.4% at room temperature while maintaining a tensile strength of 23.1 MPa. TPAEs, which have two distinct melting temperatures, exhibit microphase separation between the PEG and PA512 domains. This phenomenon is further corroborated by the scanning electron microscope (SEM) test. Additionally, TPAEs exhibit the SME, which can fix a temporary shape when heated, twisted, and cooled, and then recover to its original shape upon reheating, with TPAE230 demonstrating the most outstanding shape memory effect, achieving an average shape fixity ratio of 91.2% and a shape recovery ratio of 94.4%. This behavior is attributed to the fixing force provided by the PEG domains and the entropy elasticity of the physically cross-linked PA512 domains. The findings indicate that TPAEs exhibit enhanced SME in response to temperature changes. Leveraging this property, developing a temperature-sensitive device holds promise for breakthroughs in elastic temperature sensing applications.

具有可调段的温度敏感型形状记忆聚酰胺弹性体:实现卓越性能和应用前景
热塑性聚酰胺弹性体(TPAE)具有耐高温、优异的机械性能和形状记忆效应(SME)等显著特点。本研究通过两步熔融缩聚工艺制造长碳链聚酰胺(PA512)和聚乙二醇(PEG),开发了一种具有 SME 的热塑性聚酰胺弹性体。通过改变 PA512 预聚物的分子量和 PEG 的用量,研究了 TPAE 的性能。在与 SME 合成 TPAEs 的过程中,通过引入生物基丁二醇 (BDO),巧妙地实现了 COOH 和 OH 基团的关键平衡。傅立叶变换红外光谱和 1H NMR 测试证实了 TPAEs 的化学结构。通过精心设计 PA512 的分子量和改进 PEG 结构域的含量,制成的 TPAE 在室温下的断裂伸长率达到 592.4%,同时抗拉强度保持在 23.1 兆帕。具有两种不同熔化温度的 TPAE 显示出 PEG 和 PA512 结构域之间的微相分离。扫描电子显微镜(SEM)测试进一步证实了这一现象。此外,TPAE 还具有 SME 特性,即在加热、扭曲和冷却时可固定临时形状,然后在重新加热时恢复到原来的形状,其中 TPAE230 的形状记忆效果最为突出,其平均形状固定率达到 91.2%,形状恢复率达到 94.4%。这种行为归因于 PEG 结构域提供的固定力和物理交联 PA512 结构域的熵弹性。研究结果表明,TPAEs 在温度变化时表现出更强的 SME 特性。利用这一特性,开发温度敏感器件有望在弹性温度传感应用领域取得突破。
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来源期刊
CiteScore
26.00
自引率
21.40%
发文量
185
期刊介绍: Advanced Composites and Hybrid Materials is a leading international journal that promotes interdisciplinary collaboration among materials scientists, engineers, chemists, biologists, and physicists working on composites, including nanocomposites. Our aim is to facilitate rapid scientific communication in this field. The journal publishes high-quality research on various aspects of composite materials, including materials design, surface and interface science/engineering, manufacturing, structure control, property design, device fabrication, and other applications. We also welcome simulation and modeling studies that are relevant to composites. Additionally, papers focusing on the relationship between fillers and the matrix are of particular interest. Our scope includes polymer, metal, and ceramic matrices, with a special emphasis on reviews and meta-analyses related to materials selection. We cover a wide range of topics, including transport properties, strategies for controlling interfaces and composition distribution, bottom-up assembly of nanocomposites, highly porous and high-density composites, electronic structure design, materials synergisms, and thermoelectric materials. Advanced Composites and Hybrid Materials follows a rigorous single-blind peer-review process to ensure the quality and integrity of the published work.
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