Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication.

IF 3.1 3区 材料科学 Q3 CHEMISTRY, PHYSICAL
Materials Pub Date : 2024-10-31 DOI:10.3390/ma17215333
Javier de Prado, Børre Tore Børresen, Victoria Utrilla, Alejandro Ureña
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Abstract

The diffusion-bonding technique has been utilized to join various Al alloys (AA1060, AA2024, AA3003) to Cu for bimetallic anode application. This process aims to achieve robust metallic continuity to facilitate electron transfer, while carefully managing the growth of the intermetallic layer at the bonding interface. This control preserves the active volume of aluminum and prevents excessive brittleness of the anode. Optimization efforts have focused on different pressures, surface treatments of parent materials, and bonding parameters (temperature 450-500 °C and time 5-60 min). The optimal conditions identified include low bonding pressures (8 MPa), surface treatment involving polishing followed by chemical cleaning of the surfaces to be bonded, and energetic bonding conditions tailored to each specific aluminum alloy. Preliminary electrochemical characterization via cyclic voltammetry (CV) tests has demonstrated high reversibility intercalation/deintercalation reactions for up to seven cycles. The presence of the different alloying elements appears to contribute significantly to maintaining the high intercalation/deintercalation reaction reversibility without considerable modification of the reaction potentials. This effect may be attributed to alloying elements effectively reducing the overall alloy volume expansion, potentially forming highly reversible ternary/quaternary active phases, and creating a porous reaction layer on the exposed aluminum surface. These factors along with the influence of the Cu parent material collectively reduce the stress during volume expansion, which is the responsible phenomenon of the anode degradation in common Al anodes.

用于制造双金属阳极的铝与铜的固态扩散接合。
扩散键合技术已被用于将各种铝合金(AA1060、AA2024、AA3003)与铜连接起来,以应用于双金属阳极。该工艺旨在实现稳固的金属连续性,以促进电子转移,同时仔细控制结合界面金属间层的生长。这种控制可以保持铝的活性体积,防止阳极过度脆化。优化工作主要集中在不同的压力、母体材料的表面处理和键合参数(温度 450-500 °C 和时间 5-60 分钟)上。已确定的最佳条件包括低粘合压力(8 兆帕)、待粘合表面先抛光再化学清洗的表面处理以及针对每种特定铝合金的高能粘合条件。通过循环伏安法 (CV) 测试进行的初步电化学特性分析表明,插层/脱插层反应的可逆性很高,最多可持续七个循环。不同合金元素的存在似乎在很大程度上有助于维持高插层/脱插层反应可逆性,而不会对反应电位产生很大的影响。产生这种效果的原因可能是合金元素有效地降低了整个合金的体积膨胀,有可能形成高度可逆的三元/四元活性相,并在暴露的铝表面形成多孔反应层。这些因素以及铜母体材料的影响共同降低了体积膨胀过程中的应力,而这正是普通铝阳极退化的原因。
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来源期刊
Materials
Materials MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
5.80
自引率
14.70%
发文量
7753
审稿时长
1.2 months
期刊介绍: Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
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