Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yi Hyeon Ha, Jeong Il Lee, Jong-Min Kim, Byung-Seung Yim
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Abstract

The bonding properties of solderable anisotropic polymer composites (SAPCs) containing only low-melting-point alloy (LMPA) fillers need improvement. In this study, a new composite containing LMPA and high-melting-point alloy (HMPA) fillers, named LH-SAPC, was proposed, and the establishment of the conduction path and bonding properties of LH-SAPC were investigated for different LMPA/HMPA mixing proportions. Six types of LH-SAPC filled with different LMPA/HMPA mixing proportions (100:0, 80:20, 50:50, 20:80, 10:90, and 0:100) were formulated, and bonding tests were performed using the quad flat package. The LH-SAPCs containing less than 50 vol% HMPA within the LMPA/HMPA filler formed a proper and broad conduction path through of the excellent inner flowage of molten fillers within the polymer composite maintaining a low-viscosity condition, coalescence behavior between adjacent fillers, and a wetting behavior for the metallization. In addition, the mechanical bonding properties of the LH-SAPC joints improved with increasing HMPA content owing to the precipitation hardening and dispersion strengthening effects of the finely distributed Bi-rich phase and intermetallic compound particles within the conduction path and grain refinement. In contrast, as the HMPA content was excessive within the LH-SAPC, a poor conduction path was established because of the fluidity deterioration of the molten HMPA, which was attributed to the immoderate curing of the polymer composite; accordingly, the mechanical properties of the LH-SAPC joint degraded.

Abstract Image

研究填充了低熔点和高熔点合金填料的可焊接各向异性聚合物复合材料的粘接性能
仅含有低熔点合金(LMPA)填料的可焊性各向异性聚合物复合材料(SAPC)的粘结性能需要改进。本研究提出了一种含有 LMPA 和高熔点合金 (HMPA) 填料的新型复合材料,命名为 LH-SAPC,并研究了不同 LMPA/HMPA 混合比例下 LH-SAPC 传导路径的建立和粘接性能。配制了六种填充了不同 LMPA/HMPA 混合比例(100:0、80:20、50:50、20:80、10:90 和 0:100)的 LH-SAPC 并使用四扁平封装进行了粘合测试。在 LMPA/HMPA 填料中,LH-SAPCs 的 HMPA 含量低于 50vol%,通过熔融填料在聚合物复合材料中良好的内部流动性、低粘度状态、相邻填料之间的凝聚行为以及金属化的润湿行为,形成了适当而宽广的传导路径。此外,随着 HMPA 含量的增加,LH-SAPC 接头的机械粘接性能也有所改善,这是由于富铋相和金属间化合物颗粒在传导路径和晶粒细化中的精细分布产生了沉淀硬化和分散强化效应。相反,当 LH-SAPC 中的 HMPA 含量过高时,由于熔融 HMPA 的流动性变差,形成了不良的传导路径,这归因于聚合物复合材料的固化速度过慢;因此,LH-SAPC 接头的机械性能下降。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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