Extending the Transient Plane Source Scanning method for determining the specific heat capacity of low thermal conductivity materials through a numerical study
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引用次数: 0
Abstract
In contrast to the conventional Transient Plane Source (TPS) method, the Transient Plane Source Scanning (TPSS) technique allows for the direct determination of the specific heat capacity and requires the use of a specially designed sample holder for accurate measurements. While this method correctly determines the specific heat capacity of samples with moderate and high thermal conductivity, it tends to underestimate the values for those with low thermal conductivity. This paper demonstrates that the underestimated specific heat capacity results from heat loss during the measurement process. To precisely quantify the heat loss, a numerical model based on the finite element method was developed, with key material properties tuned based on measurement data. This model can closely describe the curve of measured thermal response, thereby enabling the precise determination of the specific heat capacity. Consequently, this study introduces a novel approach that incorporates numerical simulation to enhance TPSS measurements of poorly conducting samples, providing a reliable alternative for determining the specific heat capacity.
期刊介绍:
Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application.
The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta.
The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas:
- New and improved instrumentation and methods
- Thermal properties and behavior of materials
- Kinetics of thermally stimulated processes