Haoyu Gao, Tianrun Qi, Hanwen Ren, Qingmin Li, Yiqun Ma, Tao Xiao, Yidan Ma, Jian Wang
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引用次数: 0
Abstract
Optical-microforce sensor is the core of the sensing module for the insulation charge ellipsometer testing, whose thermal-mechanical stability directly affects the charge measurement reliability. In this paper, based on molecular simulation, the improved design for SU-8 photoresist-based optical-microforce sensor is proposed. It is found that carboxyl-functionalized carbon nanotube/SU-8 photoresist composite system with 75 % cross-linking index possesses the comparatively better thermal-mechanical stability. Then, based on the photolithography process, modified and unmodified optical-microforce sensors are prepared. Meanwhile, the thermal-mechanical stability is evaluated from the experimental perspective. The experiment is consistent with the molecular simulation, showing that compared with the unmodified optical-microforce sensor with measurement fluctuation of 17.6 %, the modified sensor exhibits better thermal-mechanical stability, whose measurement fluctuation is only 5.3 % during the temperature range of 25–100 °C. Further, the optical-microforce sensor measurement performance evaluation platform is built. It is shown that the modified sensor could achieve the response to different frequency, different magnitude elastic wave and picosecond pulse width elastic wave, which could be applied in the insulation charge ellipsometer testing application.
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...