Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing

IF 23.2 1区计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

Proceedings of the IEEE Pub Date : 2024-11-05 DOI:10.1109/JPROC.2024.3481315

Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli

{"title":"Room-Temperature Selective-Metallization Processes Applied to 3-D-Printed and Flexible Materials for Wireless Sensing","authors":"Valentina Palazzi;Federico Alimenti;Leonardo Pierantozzi;Matteo Ribeca;Leonardo Balocchi;Luca Valentini;Silvia Bittolo Bon;Paolo Mezzanotte;Manos M. Tentzeris;Luca Roselli","doi":"10.1109/JPROC.2024.3481315","DOIUrl":null,"url":null,"abstract":"This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"1065-1090"},"PeriodicalIF":23.2000,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742604","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10742604/","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

This article describes sensors and radio frequency (RF) components manufactured by applying selective-metallization processes (metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing) to 3-D-printed and flexible dielectric substrates. All these technologies can be implemented at room temperature, thus enabling the adoption of unconventional materials and biopolymers with low glass transition temperatures. In this article, we also describe how the above technologies are used to manufacture wireless transponders for tracking and sensing applications. Several examples of RF components are reported, including antennas, beamforming networks, Doppler radars, and wireless passive transponders based on backscatter radio. Innovative circuit design approaches (such as the via-less approach) are presented and their impact on circuit manufacturing and recyclability is discussed.

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室温选择性金属化工艺应用于用于无线传感的三维打印和柔性材料

本文介绍了在三维打印和柔性电介质基底上应用选择性金属化工艺（金属箔带、液态金属填充、电镀和无电镀以及表面压花）制造的传感器和射频（RF）元件。所有这些技术都可以在室温下实现，因此可以采用玻璃化转变温度较低的非常规材料和生物聚合物。在本文中，我们还介绍了如何利用上述技术制造用于跟踪和传感应用的无线转发器。报告中列举了几个射频元件的实例，包括天线、波束成形网络、多普勒雷达和基于反向散射无线电的无线无源转发器。报告还介绍了创新电路设计方法（如无通孔方法），并讨论了这些方法对电路制造和可回收性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the IEEE 工程技术-工程：电子与电气

CiteScore

46.40

自引率

1.00%

发文量

160

审稿时长

3-8 weeks

期刊介绍： Proceedings of the IEEE is the leading journal to provide in-depth review, survey, and tutorial coverage of the technical developments in electronics, electrical and computer engineering, and computer science. Consistently ranked as one of the top journals by Impact Factor, Article Influence Score and more, the journal serves as a trusted resource for engineers around the world.