Tao MENG , Ri-chu WANG , Zhi-yong CAI , Ying-jun YAO
{"title":"Microstructure and properties of Cu matrix composites reinforced with surface-modified Kovar particles","authors":"Tao MENG , Ri-chu WANG , Zhi-yong CAI , Ying-jun YAO","doi":"10.1016/S1003-6326(24)66606-9","DOIUrl":null,"url":null,"abstract":"<div><div>The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO<sub>4</sub> coating on the Kovar particles via vacuum deposition. Cu matrix composites reinforced with unmodified (Cu/Kovar) and modified Kovar (Cu/Kovar@) particles were prepared by hot pressing. The results demonstrate that the interfaces of Cu/FeWO<sub>4</sub> and FeWO<sub>4</sub>/Kovar in the Cu/Kovar@ composites exhibit strong bonding, and no secondary phase is generated. The presence of FeWO<sub>4</sub> impedes interfacial diffusion within the composite, resulting in an increase in grain size and a decrease in dislocation density. After surface modification of the Kovar particle, the thermal conductivity of Cu/Kovar@ composite is increased by 110% from 40.6 to 85.6 W·m<sup>−1</sup>·K<sup>−1</sup>. Moreover, the thermal expansion coefficient of the Cu/Kovar@ composite is 9.8×10<sup>−6</sup> K<sup>−1</sup>, meeting the electronic packaging requirements.</div></div>","PeriodicalId":23191,"journal":{"name":"Transactions of Nonferrous Metals Society of China","volume":"34 10","pages":"Pages 3251-3264"},"PeriodicalIF":4.7000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of Nonferrous Metals Society of China","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1003632624666069","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 0
Abstract
The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO4 coating on the Kovar particles via vacuum deposition. Cu matrix composites reinforced with unmodified (Cu/Kovar) and modified Kovar (Cu/Kovar@) particles were prepared by hot pressing. The results demonstrate that the interfaces of Cu/FeWO4 and FeWO4/Kovar in the Cu/Kovar@ composites exhibit strong bonding, and no secondary phase is generated. The presence of FeWO4 impedes interfacial diffusion within the composite, resulting in an increase in grain size and a decrease in dislocation density. After surface modification of the Kovar particle, the thermal conductivity of Cu/Kovar@ composite is increased by 110% from 40.6 to 85.6 W·m−1·K−1. Moreover, the thermal expansion coefficient of the Cu/Kovar@ composite is 9.8×10−6 K−1, meeting the electronic packaging requirements.
期刊介绍:
The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.