Microstructure evolutions induced by electron beam melting of a sintered Cu-25Cr composite

IF 3 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materialia Pub Date : 2024-10-16 DOI:10.1016/j.mtla.2024.102262

Lucas Varoto , Pierre Lhuissier , Marta Majkut , Jean-Jacques Blandin , Sophie Roure , Anthony Papillon , Mélissa Chosson , Guilhem Martin

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Abstract

Cu-Cr alloys are used as electrical contacts for medium voltage applications because of their desirable trade-off between electrical, thermal, and mechanical properties. However, few studies have investigated the microstructural evolutions caused by an electrical arc during an electrical breakdown. Herein, electron beam melting of a Cu-25Cr (wt.%) composite fabricated by solid-state sintering is used to mimic the thermal conditions of an electrical arc. The microstructure before and after melting was characterized using synchrotron x-ray computed microtomography and directly correlated with post-mortem electron microscopy observations. The melt pool consists of different zones: a fusion zone characterized by the complete melt of both Cu and Cr phases, and a partially melted zone where only the Cu phase is melted. Pores in the matrix or at the Cu/Cr interfaces are healed upon melting. Tracking large Cr-particles reveals significant spatial evolutions attributed to convective flows.

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烧结铜-25Cr 复合材料的电子束熔化引发的微观结构演变

Cu-Cr 合金因其电气、热和机械性能之间的理想平衡而被用作中压应用中的电触点。然而，很少有研究对电击过程中电弧引起的微结构演变进行调查。本文采用电子束熔化固态烧结制造的铜-25Cr（重量百分比）复合材料的方法来模拟电弧的热条件。利用同步辐射 X 射线计算机显微层析技术对熔化前后的微观结构进行了表征，并与死后电子显微镜观察结果直接相关。熔池由不同的区域组成：熔融区的特点是铜相和铬相完全熔化，而部分熔化区则只熔化了铜相。基体中或铜/铬界面上的孔隙在熔化后愈合。跟踪大的铬颗粒可以发现对流造成的显著空间变化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materialia MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

6.40

自引率

2.90%

发文量

345

审稿时长

36 days

期刊介绍： Materialia is a multidisciplinary journal of materials science and engineering that publishes original peer-reviewed research articles. Articles in Materialia advance the understanding of the relationship between processing, structure, property, and function of materials. Materialia publishes full-length research articles, review articles, and letters (short communications). In addition to receiving direct submissions, Materialia also accepts transfers from Acta Materialia, Inc. partner journals. Materialia offers authors the choice to publish on an open access model (with author fee), or on a subscription model (with no author fee).