Investigation of laminar flow and heat transfer performance of Gallium alloy based nanofluids in minichannel heat sink

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2024-10-24 DOI:10.1016/j.tsep.2024.103000

Adeel Muhammad , Usman Allauddin , Alfredo Iranzo

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引用次数: 0

Abstract

In this research, 3-D numerical analysis is carried out for single-phase laminar flow in a minichannel heat sink subjected to a uniform value of heat flux. The influence of various substrate materials (Aluminum nitride AlN, Copper alloy Cu, and Silicon Si) and different working fluids GaIn, GaIn-based nanofluids (GaIn-6 %CNT, GaIn-6 %Diamond, GaIn-6 %Alumina) and water on the maximum heat flux, pumping power, average heat transfer coefficient, total thermal resistance and pressure loss is examined for Reynolds number (Re = 300 − 1900) inside minichannel. It is noted that the substrate’s conductivity substantially influences the heat transfer coefficient of minichannel, with higher conductivity leading to a higher heat transfer coefficient. Besides, among all the coolants, the GaIn-6 %CNT alloy with superior thermal conductivity shows an enhanced heat transfer coefficient compared to other coolants in this study. Simulations results depict that the average heat transfer coefficient (h) of GaIn-6 %CNT, GaIn-6 %Diam, and GaIn-6 %Al₂O₃ relative to that of GaIn alloy is increased by 8.40 %, 7.63 %, and 0.22 %, respectively for Cu substrate at φ = 6 % and Re = 1900. Moreover, for GaIn-6 %CNT, which is used as a liquid metal nanofluid, and Cu is replaced with Si substrate, (h) increases by 35 % and 62.5 % at Re = 1900 and Re = 300, respectively. Similarly, when Cu is used to replace AlN, (h) increases by 11 % and 18.20 % for Re = 1900 and Re = 300, respectively. Finally, numerical findings of the pressure loss and pumping power for working fluids employed in minichannel are discussed and compared with the calculations obtained by analytical correlations.

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微型通道散热器中镓合金基纳米流体的层流和传热性能研究

本研究针对热通量值均匀的微型通道散热器中的单相层流进行了三维数值分析。在雷诺数（Re = 300 - 1900）条件下，研究了不同基底材料（氮化铝 AlN、铜合金 Cu 和硅 Si）和不同工作流体 GaIn、GaIn 基纳米流体（GaIn-6 %CNT、GaIn-6 %金刚石、GaIn-6 %氧化铝）以及水对微型通道内最大热通量、泵功率、平均传热系数、总热阻和压力损失的影响。结果表明，基质的电导率对微型通道的传热系数有很大影响，电导率越高，传热系数越大。此外，在所有冷却剂中，GaIn-6 %CNT 合金具有更高的热传导率，与本研究中的其他冷却剂相比，其热传导系数更高。模拟结果表明，在 φ = 6 % 和 Re = 1900 条件下，对于铜基板，GaIn-6 %CNT、GaIn-6 %Diam 和 GaIn-6 %Al2O3 的平均传热系数（h）相对于 GaIn 合金分别提高了 8.40 %、7.63 % 和 0.22 %。此外，对于用作液态金属纳米流体的 GaIn-6 %CNT，如果用硅衬底代替铜，则在 Re = 1900 和 Re = 300 时，(h) 分别增加 35 % 和 62.5 %。同样，当用 Cu 替代 AlN 时，在 Re = 1900 和 Re = 300 条件下，(h) 分别增加了 11 % 和 18.20 %。最后，讨论了微型通道中使用的工作流体的压力损失和泵送功率的数值结果，并将其与分析相关计算结果进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.