The development and characterisation of 3D-printed multi-material thermistor

IF 10.3 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Umur I. Cicek , Darren J. Southee , Andrew A. Johnson
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引用次数: 0

Abstract

This paper introduces a multi-material, low-cost, and highly sensitive thermistor concept developed for body temperature monitoring. The designed thermistor utilises poly(3,4-ethylenedioxythophene):poly(4-styrenesulfonate) (PEDOT:PSS) for the temperature sensing layer, silver (Ag) for the contact electrodes, and polycarbonate (PC) as the substrate. In contrast to traditional printed electronics substrates used in thermistor development, the utilisation of Material Extrusion via Fused Deposition Modelling (FDM) for the manufacture of PC substrates is the distinct feature of the work. For the manufacture of multi-material thermistors, two different Additive Manufacturing (AM) methods, FDM for substrates and micro dispensing for PEDOT:PSS sensing layer and Ag electrodes, were employed. Two thermistors with varying sensing areas, namely D1 and D2, were designed and fabricated. The thermistors demonstrated a high degree of linearity and repeatability within the temperature range of 25–45°C with a viable hysteresis maximum around 3 %. The measurement sensitivity of thermistors was assessed based on Temperature Coefficient of Resistance (TCR) values, which were –0.68 ±0.057 % and –0.49 ±0.078 % per °C for the D1 design and –0.53 ±0.078 % and –0.40 ±0.069 % per °C for the D2 design, during heating and cooling, respectively. Comparable average response and recovery times to those reported in the literature were also acquired, which were 31.47 ±1.02 and 54.42 ±0.70 seconds for the D1 design and 27.38 ±0.96 and 48.45 ±1.69 seconds for the D2 design, during heating and cooling, respectively. It was evident that the sensing area had an impact on thermistor TCR as well as response and recovery times, where higher TCR and faster response and recovery times were recorded with the small sensing area. It was also observed that humidity had a significant impact on thermistor reliability, exhibiting a normalised resistance change of ∼12 % and ∼9 % of the initial measurement at 50 % and 75 % RH, respectively. When compared to PEDOT:PSS-based thermistors reported in the literature, the obtained results in this research have demonstrated that our multi-material thermistor concept is a promising candidate for the low-cost and highly sensitive multi-material thermistor that can be manufactured in a fully additive manner using AM technologies.
三维打印多材料热敏电阻的开发与表征
本文介绍了一种用于体温监测的多材料、低成本、高灵敏度热敏电阻概念。所设计的热敏电阻采用聚(3,4-亚乙二氧基噻吩):聚(4-苯乙烯磺酸)(PEDOT:PSS)作为感温层,银(Ag)作为接触电极,聚碳酸酯(PC)作为基板。与热敏电阻开发中使用的传统印刷电子基底不同,这项工作的显著特点是通过熔融沉积建模(FDM)利用材料挤压来制造 PC 基底。在制造多材料热敏电阻时,采用了两种不同的快速成型制造(AM)方法:FDM 用于基板,微点涂敷用于 PEDOT:PSS 传感层和银电极。设计并制造了两个具有不同传感区域的热敏电阻,即 D1 和 D2。在 25-45°C 的温度范围内,热敏电阻具有很高的线性度和可重复性,滞后最大值约为 3%。热敏电阻的测量灵敏度根据电阻温度系数 (TCR) 值进行评估,在加热和冷却过程中,D1 设计的电阻温度系数分别为每摄氏度 -0.68 ±0.057 % 和 -0.49 ±0.078 %,D2 设计的电阻温度系数分别为每摄氏度 -0.53 ±0.078 % 和 -0.40 ±0.069 %。在加热和冷却过程中,D1 设计的平均响应时间和恢复时间分别为 31.47 ±1.02 秒和 54.42 ±0.70 秒,D2 设计的平均响应时间和恢复时间分别为 27.38 ±0.96 秒和 48.45 ±1.69 秒,与文献报道的时间相当。很明显,传感面积对热敏电阻的温度系数以及响应和恢复时间都有影响,传感面积小的热敏电阻温度系数更高,响应和恢复时间更快。此外,湿度对热敏电阻的可靠性也有显著影响,在相对湿度为 50% 和 75% 时,归一化电阻变化分别为初始测量值的 12% 和 9%。与文献中报道的基于 PEDOT:PSS 的热敏电阻相比,本研究获得的结果表明,我们的多材料热敏电阻概念是低成本、高灵敏度的多材料热敏电阻的理想候选材料,可以使用 AM 技术以完全添加的方式制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Additive manufacturing
Additive manufacturing Materials Science-General Materials Science
CiteScore
19.80
自引率
12.70%
发文量
648
审稿时长
35 days
期刊介绍: Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects. The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.
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