{"title":"Surface oxidation engineering for enhanced interface bonding achieving excellent electronic properties in multilayer nitrogen doped graphene/Cu composites wires","authors":"","doi":"10.1016/j.coco.2024.102139","DOIUrl":null,"url":null,"abstract":"<div><div>Graphene/Cu composites have attracted significant research attention due to their exceptional electrical conductivity and ampacity. However, the growth of high-quality graphene on curved copper surfaces remains challenging due to the poor wettability between Cu and C. This study presents a novel approach for the in-situ growth of nitrogen-doped graphene/Cu composite wire utilizing copper wire surface oxidation and microwave plasma heating. Nitrogen defects and CuO nanoparticles enhance the Cu-C interface, promoting uniform graphene growth, efficient electron transfer and Joule heat dissipation. Consequently, the composite wire demonstrates a 10.4 % improvement in electrical conductivity and a 48.6 % increase in ampacity. The finite element simulation was employed to investigate the primary mechanisms underlying ampacity enhancement and thermal failure in nitrogen-doped graphene/Cu wire. This work offers a promising strategy for improving the graphene-Cu interface, paving the way for advanced composite wires with superior electrical properties.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":null,"pages":null},"PeriodicalIF":6.5000,"publicationDate":"2024-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Communications","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2452213924003309","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}
引用次数: 0
Abstract
Graphene/Cu composites have attracted significant research attention due to their exceptional electrical conductivity and ampacity. However, the growth of high-quality graphene on curved copper surfaces remains challenging due to the poor wettability between Cu and C. This study presents a novel approach for the in-situ growth of nitrogen-doped graphene/Cu composite wire utilizing copper wire surface oxidation and microwave plasma heating. Nitrogen defects and CuO nanoparticles enhance the Cu-C interface, promoting uniform graphene growth, efficient electron transfer and Joule heat dissipation. Consequently, the composite wire demonstrates a 10.4 % improvement in electrical conductivity and a 48.6 % increase in ampacity. The finite element simulation was employed to investigate the primary mechanisms underlying ampacity enhancement and thermal failure in nitrogen-doped graphene/Cu wire. This work offers a promising strategy for improving the graphene-Cu interface, paving the way for advanced composite wires with superior electrical properties.
期刊介绍:
Composites Communications (Compos. Commun.) is a peer-reviewed journal publishing short communications and letters on the latest advances in composites science and technology. With a rapid review and publication process, its goal is to disseminate new knowledge promptly within the composites community. The journal welcomes manuscripts presenting creative concepts and new findings in design, state-of-the-art approaches in processing, synthesis, characterization, and mechanics modeling. In addition to traditional fiber-/particulate-reinforced engineering composites, it encourages submissions on composites with exceptional physical, mechanical, and fracture properties, as well as those with unique functions and significant application potential. This includes biomimetic and bio-inspired composites for biomedical applications, functional nano-composites for thermal management and energy applications, and composites designed for extreme service environments.