Appreciable amelioration in the dielectric and energy storage behavior of the electrospun fluoropolymer PVDF-HFP thick films: Effect of hot-pressing

IF 5.4 2区医学 Q2 MATERIALS SCIENCE, BIOMATERIALS

ACS Biomaterials Science & Engineering Pub Date : 2024-10-29 DOI:10.1016/j.est.2024.114337

Sudhanshu Dhumrash , Anamol Gautam , Ajeet Kumar , Nitin Jaglan , Poonam Uniyal

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Abstract

Prospects of applicability of electrospun Poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP) films for high energy density capacitors operable under harsh conditions (30 °C - 80 °C) has been investigated. The dielectric and energy storage behavior of structurally and morphologically characterized electrospun hot-pressed PVDF-HFP film has been thoroughly studied and analyzed in the temperature range of 30 °C - 80 °C. The pristine film, film hot-pressed at 110 °C and 150 °C are nominated as H-0, H-110 and H-150. The dielectric constant (ε) and dielectric loss (tanδ) of H-150 film at 1 kHz is found to be ∼13.4 and ∼ 0.04 respectively; whereas the respective values for H-110 films are ∼9.8 and ∼ 0.08. The dielectric properties of H-150 film are relatively more thermally stable as compared to H-110 film up to 80 °C. Discharge energy density, energy efficiency and breakdown strength for H-150 film are 3.7 J/cm³, 56 % and 1189 kV/cm respectively, which is remarkably higher as compared to H-0 with respective values as 0.128 J/cm³, 20 % and 352 kV/cm and H-110 film with respective values as 0.598 J/cm³, 42 % and 771 kV/cm. The superior dielectric properties, breakdown strength and energy storage behavior of PVDF-HFP film hot-pressed at 150 °C is attributed to the formation of a micro capacitive network caused by interfacial connectivity and alignment of the nanofibers. Hot-pressing of nanofiber polymeric films is a simple yet effective technique that could be a futuristic approach to develop dielectric films for high energy density capacitors.

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电纺含氟聚合物 PVDF-HFP 厚膜的介电和储能性能明显改善：热压的影响

研究人员调查了电纺聚偏氟乙烯-六氟丙烯（PVDF-HFP）薄膜在恶劣条件（30 °C - 80 °C）下用于高能量密度电容器的应用前景。在 30 °C - 80 °C 的温度范围内，对具有结构和形态特征的电纺热压 PVDF-HFP 薄膜的介电和储能行为进行了深入研究和分析。原始薄膜、110 ℃ 和 150 ℃ 热压薄膜分别被命名为 H-0、H-110 和 H-150。在 1 kHz 频率下，H-150 薄膜的介电常数（ε）和介电损耗（tanδ）分别为 ∼ 13.4 和 ∼ 0.04；而 H-110 薄膜的介电常数（ε）和介电损耗（tanδ）分别为 ∼ 9.8 和 ∼ 0.08。与 H-110 薄膜相比，H-150 薄膜的介电性能在 80 °C 以下具有更高的热稳定性。H-150 薄膜的放电能量密度、能量效率和击穿强度分别为 3.7 J/cm3、56 % 和 1189 kV/cm，明显高于 H-0（分别为 0.128 J/cm3、20 % 和 352 kV/cm）和 H-110 薄膜（分别为 0.598 J/cm3、42 % 和 771 kV/cm）。在 150 °C 下热压的 PVDF-HFP 薄膜具有优异的介电性能、击穿强度和储能行为，这归功于纳米纤维的界面连接和排列形成了微电容网络。热压纳米纤维聚合物薄膜是一种简单而有效的技术，可作为开发高能量密度电容器介电薄膜的未来方法。

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来源期刊

ACS Biomaterials Science & Engineering Materials Science-Biomaterials

CiteScore

10.30

自引率

3.40%

发文量

413

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