Investigating anisotropic effects and optimizing parameters in ultra-short pulsed (USP) laser machining of single crystalline diamond (SCD)

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design Pub Date : 2024-10-17 DOI:10.1016/j.matdes.2024.113365

Kiran Michael , Lukas Greiner , Matthias Putzer , Jodok Weixler , Timo Schudeleit , Markus Bambach , Konrad Wegener

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Abstract

This research investigates the anisotropic behavior of single crystalline diamonds (SCD) during ultra-short pulse (USP) laser machining. The ablation behavior of SCD synthesized by high-pressure high-temperature (HPHT) and chemical vapor deposition (CVD) methods is studied on their primary crystallographic planes: {100}, {110}, and {111}. The results show different ablation thresholds for each plane, with the {100} plane having the highest threshold for both SCD types. CVD diamonds exhibit higher ablation thresholds than HPHT diamonds, indicating synthesis methods influence USP laser machining. The anisotropy of material removal, breakouts, and cracks, dependent on the in-plane machining angle, is investigated by machining grooves on the {100}, {110}, and {111} planes. Each plane shows unique characteristics, with varying anisotropic behavior at different in-plane angles. The material removal rate (MRR) differs between planes and even between grooves at different in-plane angles on the same plane. Distinct cracking behaviors are also observed, emphasizing the relationship between the crystallographic plane and the in-plane angle. The ideal in-plane angle for stable and clean ablation on each plane is determined. Temporal beam shaping, with MHz burst pulses, effectively minimizes detrimental effects such as cracks during SCD processing, enhancing machining quality and expanding USP laser machining applicability.

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研究单晶金刚石 (SCD) 超短脉冲 (USP) 激光加工过程中的各向异性效应并优化参数

本研究调查了单晶金刚石（SCD）在超短脉冲（USP）激光加工过程中的各向异性行为。研究了通过高压高温（HPHT）和化学气相沉积（CVD）方法合成的单晶金刚石（SCD）在其主要晶面：{100}、{110}和{111}上的烧蚀行为。结果显示，每个平面的烧蚀阈值不同，{100}平面对两种 SCD 类型的烧蚀阈值最高。CVD 金刚石的烧蚀阈值高于 HPHT 金刚石，这表明合成方法会影响 USP 激光加工。通过在{100}、{110}和{111}平面上加工沟槽，研究了材料去除、断裂和裂纹的各向异性与平面内加工角度的关系。每个平面都显示出独特的特性，在不同的面内角度下具有不同的各向异性。不同平面的材料去除率（MRR）不同，甚至同一平面上不同面内角度的沟槽的材料去除率也不同。此外，还观察到了不同的开裂行为，强调了晶体平面与面内角度之间的关系。确定了在每个平面上实现稳定和清洁烧蚀的理想面内角度。使用 MHz 突发脉冲的时间光束整形能有效减少 SCD 加工过程中的裂纹等有害影响，从而提高加工质量并扩大 USP 激光加工的适用范围。

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来源期刊

Materials & Design Engineering-Mechanical Engineering

CiteScore

14.30

自引率

7.10%

发文量

1028

审稿时长

85 days

期刊介绍： Materials and Design is a multi-disciplinary journal that publishes original research reports, review articles, and express communications. The journal focuses on studying the structure and properties of inorganic and organic materials, advancements in synthesis, processing, characterization, and testing, the design of materials and engineering systems, and their applications in technology. It aims to bring together various aspects of materials science, engineering, physics, and chemistry. The journal explores themes ranging from materials to design and aims to reveal the connections between natural and artificial materials, as well as experiment and modeling. Manuscripts submitted to Materials and Design should contain elements of discovery and surprise, as they often contribute new insights into the architecture and function of matter.