Material removal mechanism of TiCp/Fe composite by multi-diamond-abrasive-grinding considering the random distribution characteristics of particles

IF 4.3 3区材料科学 Q2 MATERIALS SCIENCE, COATINGS & FILMS

Diamond and Related Materials Pub Date : 2024-10-16 DOI:10.1016/j.diamond.2024.111675

Qingzhe Meng , Zhenzhong Zhang , Laixiao Lu , Hongyu Xing , Xiaoliang Liang

{"title":"Material removal mechanism of TiCp/Fe composite by multi-diamond-abrasive-grinding considering the random distribution characteristics of particles","authors":"Qingzhe Meng , Zhenzhong Zhang , Laixiao Lu , Hongyu Xing , Xiaoliang Liang","doi":"10.1016/j.diamond.2024.111675","DOIUrl":null,"url":null,"abstract":"<div><div>The TiC ceramics reinforced Fe matrix composite (TiCp/Fe) exhibits exceptional properties, including high hardness, strength, wear, and heat resistance. This study focuses on investigating the material removal mechanism to achieve high-quality and low-damage surfaces. A three-dimensional particle random distribution algorithm is proposed based on the random distribution characteristics of TiC particles. Furthermore, a multi-diamond-abrasive grinding finite element model is established using the Rayleigh probability distribution model to account for the randomness of undeformed chip thickness during the grinding process. This study combines experimental and simulation analyses to investigate the variations in grinding forces, stress field distributions, and surface and subsurface quality. The results reveal that the material removal process can be categorized into five stages: ploughing of the Fe matrix and TiC particle, TiC particle crack initiation, TiC particle crack extension, and TiC particle fracture. Moreover, the process of removing TiC particles can be further grouped into ductile removal, ductile-brittle removal, and brittle removal, depending on the undeformed chip thickness. This study improves the comprehension of the mechanism of TiCp/Fe composite material and establishes a significant practical guidance for the diamond grinding processing of metal matrix composites.</div></div>","PeriodicalId":11266,"journal":{"name":"Diamond and Related Materials","volume":"150 ","pages":"Article 111675"},"PeriodicalIF":4.3000,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Diamond and Related Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925963524008884","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}

引用次数: 0

Abstract

The TiC ceramics reinforced Fe matrix composite (TiCp/Fe) exhibits exceptional properties, including high hardness, strength, wear, and heat resistance. This study focuses on investigating the material removal mechanism to achieve high-quality and low-damage surfaces. A three-dimensional particle random distribution algorithm is proposed based on the random distribution characteristics of TiC particles. Furthermore, a multi-diamond-abrasive grinding finite element model is established using the Rayleigh probability distribution model to account for the randomness of undeformed chip thickness during the grinding process. This study combines experimental and simulation analyses to investigate the variations in grinding forces, stress field distributions, and surface and subsurface quality. The results reveal that the material removal process can be categorized into five stages: ploughing of the Fe matrix and TiC particle, TiC particle crack initiation, TiC particle crack extension, and TiC particle fracture. Moreover, the process of removing TiC particles can be further grouped into ductile removal, ductile-brittle removal, and brittle removal, depending on the undeformed chip thickness. This study improves the comprehension of the mechanism of TiCp/Fe composite material and establishes a significant practical guidance for the diamond grinding processing of metal matrix composites.

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考虑颗粒随机分布特性的多金刚石磨料磨削 TiCp/Fe 复合材料的材料去除机理

TiC 陶瓷增强铁基复合材料（TiCp/Fe）具有优异的性能，包括高硬度、高强度、耐磨性和耐热性。本研究的重点是研究材料去除机制，以获得高质量和低损伤的表面。根据 TiC 颗粒的随机分布特性，提出了一种三维颗粒随机分布算法。此外，利用瑞利概率分布模型建立了多金刚石磨削有限元模型，以考虑磨削过程中未变形切屑厚度的随机性。本研究结合实验和模拟分析，研究了磨削力、应力场分布以及表面和次表面质量的变化。结果表明，材料去除过程可分为五个阶段：铁基体和 TiC 粒子的犁耕、TiC 粒子裂纹的产生、TiC 粒子裂纹的扩展和 TiC 粒子的断裂。此外，根据未变形切屑厚度的不同，TiC 颗粒的去除过程还可进一步分为韧性去除、韧性-脆性去除和脆性去除。这项研究加深了对 TiCp/Fe 复合材料机理的理解，为金属基复合材料的金刚石磨削加工提供了重要的实践指导。

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来源期刊

Diamond and Related Materials 工程技术-材料科学：综合

CiteScore

6.00

自引率

14.60%

发文量

702

审稿时长

2.1 months

期刊介绍： DRM is a leading international journal that publishes new fundamental and applied research on all forms of diamond, the integration of diamond with other advanced materials and development of technologies exploiting diamond. The synthesis, characterization and processing of single crystal diamond, polycrystalline films, nanodiamond powders and heterostructures with other advanced materials are encouraged topics for technical and review articles. In addition to diamond, the journal publishes manuscripts on the synthesis, characterization and application of other related materials including diamond-like carbons, carbon nanotubes, graphene, and boron and carbon nitrides. Articles are sought on the chemical functionalization of diamond and related materials as well as their use in electrochemistry, energy storage and conversion, chemical and biological sensing, imaging, thermal management, photonic and quantum applications, electron emission and electronic devices. The International Conference on Diamond and Carbon Materials has evolved into the largest and most well attended forum in the field of diamond, providing a forum to showcase the latest results in the science and technology of diamond and other carbon materials such as carbon nanotubes, graphene, and diamond-like carbon. Run annually in association with Diamond and Related Materials the conference provides junior and established researchers the opportunity to exchange the latest results ranging from fundamental physical and chemical concepts to applied research focusing on the next generation carbon-based devices.