Mechanically strong, transparent polyimide composite thin films with a low dielectric constant

Abstract

Aromatic polyimide is widely used in microelectronics as dielectric packaging layers. There is a high demand to reduce its dielectric constant to meet the fast development of communication technology. Here we report a simple and eco-friendly approach to preparing polyimide films with a lowered dielectric constant by adding silica hollow nanospheres with an average size of 100 nm in an aqueous solution of poly(amic acid) salt, and subsequent film casting and thermal imidization. The silica hollow nanospheres present a uniform distribution in polyimide matrix after surface modification with 3-aminopropyltriethoxysilane. The dielectric constant of the resulting composite films decreases linearly with particle loading till 15 wt% and reaches the lowest value of 2.5. The surface hardness and elastic modulus of the films improve by adding hollow nanospheres, while maintaining high optical transparency, high flexibility and a low coefficient of thermal expansion.