{"title":"Influence of heat input on pinless friction stir spot welding of aluminum‑copper dissimilar materials","authors":"","doi":"10.1016/j.matchar.2024.114456","DOIUrl":null,"url":null,"abstract":"<div><div>The composite structures of aluminum/copper dissimilar materials hold significant practical value and potential in advanced technology and industrial applications. This study conducted lap welding experiments on 2 mm thick T2 copper and 1060 pure aluminum rods using the pinless friction stir spot welding process. By varying the dwelling time of the tool, the evolution behavior of the Cu<img>Al interface layer and the mechanical properties of the joints were analyzed. At low dwelling times, the heat input was relatively low, resulting in a thinner IMC layer and the best mechanical properties of the joints, with a pull-out force of 2238.2 N and a tensile strength of 28.49 MPa. The fracture modes of the joints under all parameters were brittle fractures. The connection of aluminum/copper dissimilar materials involves two processes: firstly, the diffusion bonding dominated by kinetics at the initial welding stage; and secondly, the solid-liquid instantaneous bonding dominated by thermodynamics. When the welding temperature exceeds the melting point of aluminum, the aluminum/copper interface continuously undergoes transformation-bonding-retransformation processes until the welding process is completed.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":null,"pages":null},"PeriodicalIF":4.8000,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580324008374","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0
Abstract
The composite structures of aluminum/copper dissimilar materials hold significant practical value and potential in advanced technology and industrial applications. This study conducted lap welding experiments on 2 mm thick T2 copper and 1060 pure aluminum rods using the pinless friction stir spot welding process. By varying the dwelling time of the tool, the evolution behavior of the CuAl interface layer and the mechanical properties of the joints were analyzed. At low dwelling times, the heat input was relatively low, resulting in a thinner IMC layer and the best mechanical properties of the joints, with a pull-out force of 2238.2 N and a tensile strength of 28.49 MPa. The fracture modes of the joints under all parameters were brittle fractures. The connection of aluminum/copper dissimilar materials involves two processes: firstly, the diffusion bonding dominated by kinetics at the initial welding stage; and secondly, the solid-liquid instantaneous bonding dominated by thermodynamics. When the welding temperature exceeds the melting point of aluminum, the aluminum/copper interface continuously undergoes transformation-bonding-retransformation processes until the welding process is completed.
期刊介绍:
Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.
The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.
The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:
Metals & Alloys
Ceramics
Nanomaterials
Biomedical materials
Optical materials
Composites
Natural Materials.