Engineering texture and twins of Cu foils preparing by pulse electrodeposition and their properties

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2024-10-20 DOI:10.1016/j.matchar.2024.114477

Jiaming Cao , Yimeng Li , Jianan Liu , Ke Zhan , Bin Zhao , Vincent Ji

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Abstract

The controllable microstructure and the overall performance improvement of electrodeposited nano twinned Cu (nt-Cu) foil are crucial for the sustainable development of high energy density batteries and microelectronics technology. Although pulse electrodeposition (PED) and additives have been widely used in controlling nt-Cu foil, there is still a lack of research on the controllable microstructure of nt-Cu foil and its microstructure depended properties. In this study, nt-Cu foils with different orientations were prepared by adjusting the T_off time and additives during the PED process. The effects of these parameters on the microstructure and comprehensive properties of the nt-Cu foil were studied. The T_off time and polyethylene glycol (PEG)-3-mercapto-1-propanesulfonate sodium salt (MPS)-(chloride ions)Cl⁻ (PEG-MPS-Cl⁻) additive changed the kinetic parameters of the electrochemical reaction and ultimately affected the reduction rate of Cu²⁺ and the overpotential of the deposition process. This modulation effectively regulated the nucleation and growth behavior of Cu atoms, thereby reducing the surface roughness of the nt-Cu foil, refining the grains, and forming nano-twins with different orientations. Due to the combined strengthening effect of grain refinement, dislocation, and texture orientation, (111) oriented nt-Cu foil demonstrated remarkable mechanical and frictional wear properties, whereas (220) oriented nt-Cu foil exhibited superior conductivity and corrosion resistance. These findings may offer promising prospects for the controllable design of engineering textures and nano-twin structures of high-performance nt-Cu foil by electrodeposition.

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脉冲电沉积制备的铜箔的工程纹理和孪晶及其特性

电沉积纳米孪晶铜（nt-Cu）箔的可控微观结构和整体性能的提高对高能量密度电池和微电子技术的可持续发展至关重要。尽管脉冲电沉积（PED）和添加剂已被广泛应用于控制 nt-Cu 箔，但对 nt-Cu 箔的可控微观结构及其微观结构相关性能的研究仍然缺乏。本研究通过调整 PED 过程中的 Toff 时间和添加剂制备了不同取向的 nt-Cu箔。研究了这些参数对 nt-Cu 箔微观结构和综合性能的影响。Toff 时间和聚乙二醇（PEG）-3-巯基-1-丙磺酸钠盐（MPS）-（氯离子）Cl-（PEG-MPS-Cl-）添加剂改变了电化学反应的动力学参数，并最终影响了 Cu2+ 的还原速率和沉积过程的过电位。这种调制有效地调节了铜原子的成核和生长行为，从而降低了 nt-Cu 箔的表面粗糙度，细化了晶粒，并形成了不同取向的纳米孪晶。由于晶粒细化、位错和纹理取向的综合强化效应，（111）取向的正铜箔表现出了显著的机械和摩擦磨损性能，而（220）取向的正铜箔则表现出了优异的导电性和耐腐蚀性。这些发现为通过电沉积可控设计高性能镍铜箔的工程纹理和纳米孪晶结构提供了广阔的前景。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.