Enhanced strength and ductility of boron nitride nanosheet reinforced cu composites through constructing an interfacial three-dimensional structure

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2024-10-19 DOI:10.1016/j.matchar.2024.114474

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引用次数: 0

Abstract

To address the poor wettability and weak interface bonding between boron nitride nanosheet (BNNS) and Cu, BNNS/CuTi composites were prepared through matrix microalloying by adding 1 wt% Ti. Solid-state interfacial reactions resulted in the formation of TiN transition layers and TiB whiskers (TiBw), collectively constructed a BNNS-(TiN&TiB)-Cu interfacial three-dimensional structure (I-3DS). The coherent I-3DS significantly reduced the interfacial energy, improved the interfacial stability, and achieved a favorable combination of strength and ductility in BNNS/CuTi composites. The 0.1 wt% BNNS/CuTi composite achieved an ultimate tensile strength (UTS) of 485 MPa, representing increases of 114 % and 62 % over pure Cu and 0.1 wt% BNNS/Cu composite, respectively. The interlocking structure formed by I-3DS and Cu doubled the theoretical interface shear strength limit and improved load transfer efficiency. This study offered new insights into the innovative design of high-performance Cu matrix composites (CMCs) by constructing I-3DS.

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通过构建界面三维结构增强氮化硼纳米片强化铜复合材料的强度和延展性

为了解决氮化硼纳米片（BNNS）与铜之间润湿性差和界面结合力弱的问题，通过添加 1 wt% Ti 进行基体微合金化制备了 BNNS/CuTi 复合材料。固态界面反应形成了 TiN 过渡层和 TiB 晶须（TiBw），共同构建了 BNNS-（TiN&TiB）-Cu 界面三维结构（I-3DS）。协调一致的 I-3DS 显著降低了界面能，提高了界面稳定性，并实现了 BNNS/CuTi 复合材料强度和延展性的良好结合。0.1 wt% BNNS/CuTi 复合材料的极限拉伸强度 (UTS) 达到 485 兆帕，比纯铜和 0.1 wt% BNNS/Cu 复合材料分别提高了 114% 和 62%。I-3DS 和铜形成的互锁结构使界面剪切强度理论极限提高了一倍，并提高了载荷传递效率。这项研究为通过构建 I-3DS 创新设计高性能铜基复合材料（CMC）提供了新的见解。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.