Fabrication and enhanced electrical stability of Mn–Co–Fe–Zn–O NTC thin films by low temperature ion-beam-assisted deposition technology

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yibo He, Yuxian Song, Xinmiao Wang, Xijun Yan, Shusheng Pan, Wenwen Kong
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引用次数: 0

Abstract

The Mn–Co–Fe–Zn–O negative temperature coefficient (NTC) thin films, vital for next-gen temperature sensors, face a pivotal hurdle in enhancing electrical stability. This study triumphantly crafted these films with ultra-high stability using ion-beam-assisted deposition (IBAD) at a relatively low temperature (240 °C). All films obtained under three different ion-beam types, Ar, O2, and None, exhibit a dense, grain homogeneous morphology as well as a single spinel phase structure, and all show excellent NTC characteristics over the temperature range of 10–90 °C. The XRD peak shift and Raman signal attenuation indicate that ion-beam bombardment exerts control over the crystal structure. The application of Ar ion-beam assistance resulted in a significant reduction in film ageing drift, from 4.23% to 0.58%. This reduction was achieved by the Jahn–Teller distortions induced by the high concentration of Mn3+, and the low oxygen vacancy concentration. Further, the low processing temperature augments process compatibility with heat-sensitive substrates, safeguarding them from harm and hinting at vast potential in integrated circuits and innovative electronics manufacturing.

利用低温离子束辅助沉积技术制备 Mn-Co-Fe-Zn-O NTC 薄膜并增强其电气稳定性
Mn-Co-Fe-Zn-O 负温度系数(NTC)薄膜对下一代温度传感器至关重要,但在提高电稳定性方面却面临着关键的障碍。本研究利用离子束辅助沉积(IBAD)技术,在相对较低(240 ℃)的温度下成功制作出了具有超高稳定性的薄膜。在 Ar、O2 和 None 三种不同离子束类型下获得的所有薄膜都呈现出致密、晶粒均匀的形态以及单一尖晶石相结构,并且在 10-90 °C 的温度范围内均表现出优异的 NTC 特性。XRD 峰值移动和拉曼信号衰减表明离子束轰击对晶体结构起到了控制作用。应用氩离子束辅助可显著降低薄膜的老化漂移,从 4.23% 降至 0.58%。高浓度的 Mn3+ 和低氧空位浓度引起的 Jahn-Teller 扭曲实现了这一降低。此外,低加工温度提高了与热敏基底的工艺兼容性,使其免受损害,并预示着在集成电路和创新电子制造领域的巨大潜力。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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