Abla Kamilia Madkour, Fatiha Rogti, Linda Aissani, Ahmed Hamdi, Ahlam Belgroune, Abdelhalim Zoukel
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引用次数: 0
Abstract
CdS thin films have been successfully electrodeposited by introducing oxalic acid in the electrolytic solution as a novel complexing agent to prevent sulfide precipitation. The CdS films were grown on an FTO/glass substrate at − 0.890 V for 10 min and then annealed at 120 °C and 400 °C, respectively, in air. X-ray diffraction revealed that the CdS films have mixed hexagonal and cubic phases with (311) cubic-CdS preferred orientation. Scanning electron microscopy (SEM) results illustrated a transition from compact grains with more spherical precipitations on the surface at 120 °C to denser and homogeneous structure with a large crystallite size at 400 °C. The energy dispersive spectroscopy (EDS) revealed a decrease in the S content and an under-stoichiometric composition of CdS film at 400 °C. The band gap value decreased from 2.47 to 2.24 eV as the annealing temperature increased, while optimum transmittance was obtained at 120 °C. Mott–Schottky analysis revealed n-type conductivity for both samples where the flat band potential and donor density vary with the annealing temperature from − 0.99 to − 1.02 V and from 3.9 × 1020 to 1.1 × 1021 cm−3, respectively. The electrochemical impedance studies affirmed that the electrochemical process is under kinetic control and demonstrated lower RCT at 400 °C. PEC measurements showed enhancement in the VOC and JSC at 400 °C, indicating improved sensitivity and efficiency for photodetection. The slow decay of dark and photocurrent was attributed to defects and local potential fluctuations within the films. These findings highlight the effectiveness of using oxalic acid in the deposition process of CdS thin films making them suitable for solar cell applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.