Inter-Skeleton Conductive Routes Tuning Multifunctional Conductive Foam for Electromagnetic Interference Shielding, Sensing and Thermal Management

IF 26.6 1区材料科学 Q1 Engineering

Nano-Micro Letters Pub Date : 2024-10-28 DOI:10.1007/s40820-024-01540-z

Xufeng Li, Chunyan Chen, Zhenyang Li, Peng Yi, Haihan Zou, Gao Deng, Ming Fang, Junzhe He, Xin Sun, Ronghai Yu, Jianglan Shui, Caofeng Pan, Xiaofang Liu

引用次数: 0

Abstract

Highlights

Unique inter-skeleton conductive films are constructed in polymer foam.
The resistance change of the foam can reach four orders of magnitude under compression.
This foam exhibits strain-adaptive electromagnetic interference shielding performance, anti-interference pressure sensor with high sensitivity over a wide pressure range and compression-regulated Joule heating function.

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用于电磁干扰屏蔽、传感和热管理的骨架间导电路线调谐多功能导电泡沫。

导电聚合物泡沫（CPF）具有出色的可压缩性和可变电阻，在可穿戴电子设备的电磁干扰（EMI）屏蔽和其他集成功能方面具有广阔的应用前景。然而，其电阻随压缩应变的变化幅度不足通常会导致变形过程中屏蔽性能下降。本文提出了一种在聚合物泡沫上加载导电材料的创新策略，以显著提高导电元件在压缩条件下的接触概率和接触面积。通过在挂在泡沫骨架之间的聚甲基丙烯酸酯薄膜上加载藻酸盐装饰的磁性液态金属（称为 AMLM-PM 泡沫），构建了独特的骨架间导电薄膜。在压缩条件下，导电骨架之间的传统点接触升级为导电薄膜之间的平面接触。因此，AMLM-PM 在压缩时的电阻变化达到了四个数量级。此外，骨架间的导电膜还能提高泡沫的机械强度，防止液态金属泄漏，增加电磁波的散射面积。AMLM-PM 泡沫具有应变自适应电磁干扰屏蔽性能，并显示出压缩增强屏蔽效果，解决了传统 CPF 在压缩时的问题。电阻响应的升级还使泡沫能够在很宽的压力范围内实现灵敏的压力感应和压缩调节焦耳加热功能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Nano-Micro Letters NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

32.60

自引率

4.90%

发文量

981

审稿时长

1.1 months

期刊介绍： Nano-Micro Letters is a peer-reviewed, international, interdisciplinary, and open-access journal published under the SpringerOpen brand. Nano-Micro Letters focuses on the science, experiments, engineering, technologies, and applications of nano- or microscale structures and systems in various fields such as physics, chemistry, biology, material science, and pharmacy.It also explores the expanding interfaces between these fields. Nano-Micro Letters particularly emphasizes the bottom-up approach in the length scale from nano to micro. This approach is crucial for achieving industrial applications in nanotechnology, as it involves the assembly, modification, and control of nanostructures on a microscale.