Key Role of Positional Disorder and Soft Structural Framework for Lowering the Thermal Conductivity of Quaternary Ag1–xCu3+xTiSe4 (0 ≤ x ≤ 0.8) System to an Ultralow Limit

IF 4.4 2区 化学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Achintya Lakshan, Krishnendu Buxi, Paribesh Acharyya, Kishor Das, Biplab Koley, Kapildeb Dolui, Christophe Candolfi, Carmelo Prestipino, Emmanuel Guilmeau, Ahin Roy, Partha Pratim Jana
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引用次数: 0

Abstract

Low thermal conductive semiconductors have attracted huge attention for heat management and heat harvesting applications. Although the weak chemical bonding in the Cu/Ag-based chalcogenides is promising in suppressing heat transport, their quaternary analogs remain less explored. Here, we report on a comparative study of the crystal structure and thermal conductivity of various Ag-containing variants of Cu4TiSe4, i.e., Ag1–xCu3+xTiSe4 (x = 0–0.8) samples. Analysis of the crystal structure, phase transition, and temperature-dependent lattice thermal conductivity (κL) of pristine AgCu3TiSe4 and Ag1–xCu3+xTiSe4 have been carried out both experimentally and theoretically. The cubic crystal structure (space group P4̅3m) of these Ag variants is identical to that of Cu4TiSe4 or Cu4TiTe4, where a positionally disordered Cu sublattice is either replaced by Ag (for AgCu3TiSe4) or by Ag/Cu substructure (for Ag1–xCu3+xTiSe4). Upon cooling, the symmetry reduction to a rhombohedral (space group R3m) structure is attributed to the partial ordering of the positionally disordered Ag. The proposed structural models at different temperatures have been further analyzed using the Maximum Entropy Method (MEM). X-ray photoelectron spectroscopy measurement suggests that the parent compound forms a charge-precise (Ag+)(Cu+)3(Ti4+)(Se2–)4 chemical formula. Interestingly, the lattice thermal conductivity of the Ag1–xCu3+xTiSe4 samples remains very low, with values varying in the range of ∼0.65–0.24 W m–1 K–1 between 293 and 623 K. Density Functional Theory (DFT) calculation shows the presence of antibonding states of Cu(3d)/Ag(4d)–Se(4p) below the Fermi level (EF), providing softness to the lattice of AgCu3TiSe4. In addition, the positional disordered site plays a crucial role in further softening the framework and provides large lattice anharmonicity. The calculated phonon dispersions evidence the presence of several soft optical phonon modes at ca. 25 cm–1, originating from the atomic vibrations of Ag, Cu, and Se. Further confirmation of these phonon modes is obtained from the low-temperature heat capacity study. The low-lying optical phonon modes in AgCu3TiSe4 are mainly caused by the presence of a soft lattice framework, positional disorder and associated rattling-like vibrations of Ag+/Cu+ ions. Their strong interaction with the heat-carrying acoustic phonon modes is key ingredient that explains the very low κL.

Abstract Image

位错和软结构框架在将四元 Ag1-xCu3+xTiSe4 (0 ≤ x ≤ 0.8) 系统的导热率降至超低极限中的关键作用
低导热半导体在热管理和热收集应用方面吸引了大量关注。虽然铜/银基铬化物中的弱化学键在抑制热传输方面很有前景,但对其四元类似物的探索仍然较少。在此,我们报告了对 Cu4TiSe4 的各种含银变体(即 Ag1-xCu3+xTiSe4 (x = 0-0.8) 样品)的晶体结构和热导率的比较研究。实验和理论分析了原始 AgCu3TiSe4 和 Ag1-xCu3+xTiSe4 的晶体结构、相变和随温度变化的晶格热导率(κL)。这些银变体的立方晶体结构(空间群 P4̅3m)与 Cu4TiSe4 或 Cu4TiTe4 相同,其中位置无序的铜亚晶格要么被银取代(对于 AgCu3TiSe4),要么被银/铜子结构取代(对于 Ag1-xCu3+xTiSe4)。冷却后,对称性降低为斜方体(空间群 R3m)结构,这归因于位置无序的 Ag 的部分有序化。利用最大熵法(MEM)进一步分析了所提出的不同温度下的结构模型。X 射线光电子能谱测量表明,母体化合物形成了电荷精确的 (Ag+)(Cu+)3(Ti4+)(Se2-)4 化学式。有趣的是,Ag1-xCu3+xTiSe4 样品的晶格热导率仍然很低,在 293 至 623 K 之间的数值变化范围为 ∼0.65-0.24 W m-1 K-1。密度泛函理论(DFT)计算显示,费米级(EF)以下存在 Cu(3d)/Ag(4d)-Se(4p) 的反键态,为 AgCu3TiSe4 晶格提供了软性。此外,位置无序位点在进一步软化框架方面起着至关重要的作用,并提供了较大的晶格非谐波性。计算得出的声子频散证明,在约 25 cm-1 处存在几种软光学声子模式,它们源自 Ag、Cu 和 Se 的原子振动。低温热容量研究进一步证实了这些声子模式。AgCu3TiSe4 中的低洼光学声子模式主要是由 Ag+/Cu+ 离子的软晶格框架、位置无序和相关的嘎嘎振动引起的。它们与载热声学声子模式的强烈相互作用是解释极低 κL 的关键因素。
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来源期刊
CiteScore
7.20
自引率
6.00%
发文量
810
期刊介绍: ACS Applied Polymer Materials is an interdisciplinary journal publishing original research covering all aspects of engineering, chemistry, physics, and biology relevant to applications of polymers. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrates fundamental knowledge in the areas of materials, engineering, physics, bioscience, polymer science and chemistry into important polymer applications. The journal is specifically interested in work that addresses relationships among structure, processing, morphology, chemistry, properties, and function as well as work that provide insights into mechanisms critical to the performance of the polymer for applications.
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