HCNT/AgNPs/PVA/PAM hydrogel-based flexible pressure sensor for physiological monitoring

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2024-10-20 DOI:10.1007/s10854-024-13689-9

Junru Wang, Guoxiang Xia, Longquan Xia, Yunfeng Chen, Qinyuan Li, Hong Zeng, Weiguo Yang, Yongjie Du, Wei He, Yuanming Chen

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引用次数: 0

Abstract

Flexible wearable devices for health monitoring require continuous wear throughout the day, making flexible pressure sensors a critical component that has attracted significant attention. Polyacrylamide (PAM) and polyvinyl alcohol (PVA) were used as hydrogel substrate materials to fabricate wearable devices with on-the-go wearability. Helical carbon nanotubes (HCNTs) were employed as conductive fillers, with silver nanoparticles (AgNPs) deposited on their surface to enhance conductivity. The conductive HCNT/AgNPs fillers bonded with the PVA/PAM substrate via metal–hydrogen bonds, metal complexes, and Ag–O bonds. This bonding enhanced the binding strength of the gel and accelerated polymerization. Pressure sensors packaged within the hydrogel exhibited high sensitivity of 0.118 kPa^–1 to minor deformations and high sensitivity of 0.0141 kPa^–1 to regular deformations, providing a flexible pressure sensor with high sensitivity and fast response. This innovation delivers a highly sensitive and fast-responding flexible pressure sensor, paving the way for advanced flexible wearable electronic devices.

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基于 HCNT/AgNPs/PVA/PAM 水凝胶的柔性压力传感器用于生理监测

用于健康监测的柔性可穿戴设备需要全天候连续佩戴，因此柔性压力传感器成为备受关注的关键部件。聚丙烯酰胺（PAM）和聚乙烯醇（PVA）被用作水凝胶基底材料，用于制造可随身佩戴的可穿戴设备。螺旋碳纳米管（HCNTs）被用作导电填料，银纳米粒子（AgNPs）沉积在其表面以增强导电性。导电 HCNT/AgNPs 填料通过金属氢键、金属络合物和 Ag-O 键与 PVA/PAM 基底结合。这种结合增强了凝胶的结合强度并加速了聚合。封装在水凝胶中的压力传感器对轻微变形的灵敏度高达 0.118 kPa-1，对常规变形的灵敏度高达 0.0141 kPa-1，从而提供了一种灵敏度高、响应速度快的柔性压力传感器。这项创新提供了高灵敏度和快速响应的柔性压力传感器，为先进的柔性可穿戴电子设备铺平了道路。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.