Shilei Zhao, Jiwen Zheng, Yutong Shao, Hai Huang, Zhiwei Liu, Bin Yu, Ziyue Zhang
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引用次数: 0
Abstract
This paper proposes a high-performance radix-4 Montgomery Modular Multiplication (MMM) algorithm and its corresponding hardware architecture for Elliptic Curve Cryptography (ECC), in which the quotient and the partial product accumulation are computed in parallel in each iteration. Additionally, in this MMM, the Redundant Signed Digit (RSD) representation and the Signed Digit Adder (SDA) are used to eliminate the long carry chain and achieve parallel computation, as well as remove pre-computation and integrate modular reduction operations. Our MMM algorithm is implemented in 256-bit and 1024-bit versions on Xilinx Virtex-6 and Virtex-7 FPGAs, respectively. It consumes only 1.55k/10.18k Look-Up Tables (LUTs), takes 133/517 clock cycles, and runs at maximum frequencies of 558.8/641.7 MHz. According to the comparison in terms of Area Time Product (ATP), our design can achieve the ATP of 0.369 over the 256-bit NIST prime domain, which is approximately half of that of the state-of-the-art works. The Scalar Point Multiplication (SPM) scheme using this MMM algorithm consumes 14.19k LUTs and completes a single Scalar Point Multiplication (SPM) operation in 0.217 ms, and it also has a lower ATP than most other SPM algorithms currently in existence.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.