Thermal expansion behavior of nitrogen-processed Al6061/SiC composites

IF 3.5 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Kanhu Charan Nayak, Hyunjoo Choi, Kon-Bae Lee
{"title":"Thermal expansion behavior of nitrogen-processed Al6061/SiC composites","authors":"Kanhu Charan Nayak,&nbsp;Hyunjoo Choi,&nbsp;Kon-Bae Lee","doi":"10.1007/s10853-024-10170-0","DOIUrl":null,"url":null,"abstract":"<div><p>Developing of lightweight materials with extremely low thermal expansion is crucial across various sectors. While Invar exhibits a coefficient of thermal expansion (CTE) below 3 × 10<sup>−6</sup> °C<sup>−1</sup>, its heavy nature limits its applicability in electric vehicles and aerospace fields. The present study introduces Al6061/SiC composites produced by the nitrogen-induced self-forming aluminum composite (NISFAC) process, wherein CTE is successfully tailored down to an unprecedented value of 2.12 × 10<sup>−6</sup> °C<sup>−1</sup> at 100 °C by changing the volume fraction of SiC from 0 to 65%. In-situ AlN, formed at the interface between Al6061 and SiC particles during the NISFAC process, plays a crucial role in minimizing the thermal expansion of the composites by improving crystallographic match and adhesion between SiC particles and the Al matrix.</p></div>","PeriodicalId":645,"journal":{"name":"Journal of Materials Science","volume":"59 39","pages":"18473 - 18487"},"PeriodicalIF":3.5000,"publicationDate":"2024-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s10853-024-10170-0","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Developing of lightweight materials with extremely low thermal expansion is crucial across various sectors. While Invar exhibits a coefficient of thermal expansion (CTE) below 3 × 10−6 °C−1, its heavy nature limits its applicability in electric vehicles and aerospace fields. The present study introduces Al6061/SiC composites produced by the nitrogen-induced self-forming aluminum composite (NISFAC) process, wherein CTE is successfully tailored down to an unprecedented value of 2.12 × 10−6 °C−1 at 100 °C by changing the volume fraction of SiC from 0 to 65%. In-situ AlN, formed at the interface between Al6061 and SiC particles during the NISFAC process, plays a crucial role in minimizing the thermal expansion of the composites by improving crystallographic match and adhesion between SiC particles and the Al matrix.

氮处理 Al6061/SiC 复合材料的热膨胀行为
开发热膨胀系数极低的轻质材料对各个领域都至关重要。虽然英卡尔的热膨胀系数(CTE)低于 3 × 10-6 °C-1,但其沉重的特性限制了它在电动汽车和航空航天领域的应用。本研究介绍了采用氮气诱导自成型铝复合材料(NISFAC)工艺生产的 Al6061/SiC 复合材料,通过将 SiC 的体积分数从 0% 变为 65%,成功地将 100 °C 时的 CTE 值降低到前所未有的 2.12 × 10-6 ℃-1。在 NISFAC 工艺过程中,在 Al6061 和 SiC 颗粒之间的界面上形成的原位 AlN 通过改善 SiC 颗粒和铝基体之间的晶体匹配和粘附性,在最大限度地降低复合材料的热膨胀方面发挥了关键作用。
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来源期刊
Journal of Materials Science
Journal of Materials Science 工程技术-材料科学:综合
CiteScore
7.90
自引率
4.40%
发文量
1297
审稿时长
2.4 months
期刊介绍: The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.
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