Novel hybrid TFET-FinFET 12T SRAM cells with enhanced write margin and read performance

IF 2.2 3区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Seyed Arman Sabaghpour, Behzad Ebrahimi, Pooya Torkzadeh
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引用次数: 0

Abstract

This work presents two innovative 12T cells combining tunnel field-effect transistor (TFET) and fin field-effect transistor (FinFET) technologies. These cells address reverse bias current issues by incorporating separate paths for reading data and write enhancement cut transistors, enhancing hold/read/write static noise margin (H/R/WSNM), reducing read time, and minimizing power consumption from TFET leakage. At 0.6 V, the first (second) SRAM cell shows a WSNM improvement over O_7T, 8T, CA_10T, 12T, and HF_10T cells by 152 % (93 %), 152 % (93 %), 157.7 % (97.5 %), 95 % (50 %), and 104 % (57 %), respectively. The leakage power of the first (second) 12T TFET SRAM cell is two (four) orders of magnitude lower than O_7T and 8T SRAM cells. These hybrid SRAM cells also exhibit faster read operations across VDD voltage levels (0.3 V–1 V) and the first 12T cell demonstrates shorter write access times than 12T and CA_10T SRAM cells. These characteristics make the proposed cells particularly suitable for energy-efficient IoT devices and medical applications, where balancing power, area, performance, and data integrity is critical.
新型混合 TFET-FinFET 12T SRAM 单元,可提高写入裕度和读取性能
这项研究提出了两种结合隧道场效应晶体管(TFET)和鳍式场效应晶体管(FinFET)技术的创新型 12T 单元。这些单元通过为读取数据和写入增强型切割晶体管整合独立路径、增强保持/读取/写入静态噪声裕度 (H/R/WSNM)、缩短读取时间以及最大限度降低 TFET 漏电功耗,解决了反向偏置电流问题。在 0.6 V 电压下,第一(第二)SRAM 单元的 WSNM 比 O_7T、8T、CA_10T、12T 和 HF_10T 单元分别提高了 152 %(93 %)、152 %(93 %)、157.7 %(97.5 %)、95 %(50 %)和 104 %(57 %)。第一个(第二个)12T TFET SRAM 单元的漏功率比 O_7T 和 8T SRAM 单元低两(四)个数量级。与 12T 和 CA_10T SRAM 相比,这些混合 SRAM 单元的读取操作速度更快,跨 VDD 电压电平(0.3 V-1 V),第一个 12T 单元的写入访问时间更短。这些特性使拟议的单元特别适用于高能效物联网设备和医疗应用,在这些应用中,平衡功耗、面积、性能和数据完整性至关重要。
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来源期刊
Integration-The Vlsi Journal
Integration-The Vlsi Journal 工程技术-工程:电子与电气
CiteScore
3.80
自引率
5.30%
发文量
107
审稿时长
6 months
期刊介绍: Integration''s aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics: Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.
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