Thermal and hydraulic performance of 3D printed jet impingement configuration for SiC power modules in aerospace propulsion inverters

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2024-10-01 DOI:10.1016/j.tsep.2024.102974

Mohamed Hefny, Sam Hemming, Linke Zhou, Di Wang, Giorgio Pietrini, Ali Emadi

{"title":"Thermal and hydraulic performance of 3D printed jet impingement configuration for SiC power modules in aerospace propulsion inverters","authors":"Mohamed Hefny, Sam Hemming, Linke Zhou, Di Wang, Giorgio Pietrini, Ali Emadi","doi":"10.1016/j.tsep.2024.102974","DOIUrl":null,"url":null,"abstract":"<div><div>Efficiently controlling the temperature of power electronic inverters is crucial for aerospace applications with high power density. Effective thermal management strategies could enhance the power output of power inverters to their maximum rated capacity. Jet impingement is a promising technology with outstanding heat transfer characteristics, making it a sophisticated aid for cooling innovation in power inverters. A numerical comparative study was conducted between jet impingement and traditional pin finned heat sink. In our case study, the pin fin could not effectively regulate the junction temperature to a level below 150 °C. By using a 3D printed jet impingement housing composed of polymer, the weight of the power module thermal management system could be decreased by 71 % compared to a metallic pin finned heat sink. Moreover, this approach aids in lowering the junction temperature to 129 °C, under the same boundary conditions. Additionally, a numerical study was conducted on power modules with thermal imbalance used in aerospace inverters. The study proposed various configurations of jet impingement to reduce temperature differences between power module switches, as well as minimize the pressure drop across the jet impingement housing. The primary objective is to minimize the temperature disparity between the unbalanced switches in order to improve the overall reliability and lifespan of the power module, while decreasing the pressure drop. Among all the options, the optimum design achieves a minimal temperature difference of 24 °C between the power module switches, while the pressure drop reaches 12 kPa.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"55 ","pages":"Article 102974"},"PeriodicalIF":5.1000,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2451904924005924","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}

引用次数: 0

Abstract

Efficiently controlling the temperature of power electronic inverters is crucial for aerospace applications with high power density. Effective thermal management strategies could enhance the power output of power inverters to their maximum rated capacity. Jet impingement is a promising technology with outstanding heat transfer characteristics, making it a sophisticated aid for cooling innovation in power inverters. A numerical comparative study was conducted between jet impingement and traditional pin finned heat sink. In our case study, the pin fin could not effectively regulate the junction temperature to a level below 150 °C. By using a 3D printed jet impingement housing composed of polymer, the weight of the power module thermal management system could be decreased by 71 % compared to a metallic pin finned heat sink. Moreover, this approach aids in lowering the junction temperature to 129 °C, under the same boundary conditions. Additionally, a numerical study was conducted on power modules with thermal imbalance used in aerospace inverters. The study proposed various configurations of jet impingement to reduce temperature differences between power module switches, as well as minimize the pressure drop across the jet impingement housing. The primary objective is to minimize the temperature disparity between the unbalanced switches in order to improve the overall reliability and lifespan of the power module, while decreasing the pressure drop. Among all the options, the optimum design achieves a minimal temperature difference of 24 °C between the power module switches, while the pressure drop reaches 12 kPa.

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用于航空航天推进逆变器中 SiC 功率模块的 3D 打印喷射撞击配置的热性能和液压性能

有效控制电力电子逆变器的温度对于高功率密度的航空航天应用至关重要。有效的热管理策略可以提高功率变频器的功率输出，使其达到最大额定容量。喷射撞击是一种前景广阔的技术，具有出色的热传导特性，是功率变频器冷却创新的先进辅助工具。我们对喷射撞击和传统的针翅式散热器进行了数值比较研究。在我们的案例研究中，针形散热片无法有效地将结温调节到 150 °C 以下。通过使用由聚合物组成的 3D 打印喷射撞击外壳，功率模块热管理系统的重量比金属针式散热片减少了 71%。此外，在相同的边界条件下，这种方法还有助于将结温降至 129 °C。此外，还对航空逆变器中使用的热不平衡功率模块进行了数值研究。研究提出了各种喷射撞击配置，以减少功率模块开关之间的温差，并最大限度地降低喷射撞击外壳上的压降。主要目标是最大限度地减小不平衡开关之间的温差，以提高功率模块的整体可靠性和使用寿命，同时减小压降。在所有备选方案中，最佳设计可使功率模块开关之间的温差最小为 24 °C，而压降则达到 12 kPa。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.