Correlation between shot peening coverage and surface microstructural evolution in AISI 9310 steel: An EBSD and surface morphology analysis

IF 5.3 2区材料科学 Q1 MATERIALS SCIENCE, COATINGS & FILMS

Surface & Coatings Technology Pub Date : 2024-09-29 DOI:10.1016/j.surfcoat.2024.131406

{"title":"Correlation between shot peening coverage and surface microstructural evolution in AISI 9310 steel: An EBSD and surface morphology analysis","authors":"","doi":"10.1016/j.surfcoat.2024.131406","DOIUrl":null,"url":null,"abstract":"<div><div>In this study, martensitic high-strength steel serves as the subject of investigation, with both conventional and severe shot peening experiments being conducted. The coverage levels for conventional shot peening (CSP) are set at 100 % and 200 %, while severe shot peening (SSP) sees levels of 800 % and 1200 %. For the first time, the use of kernel average misorientation (KAM) enables the calculation of geometrically necessary dislocation (GND) density after peening, facilitating the study of GND density distribution across different coverage and offering a method for the visual assessment of peening degree. Results reveal that, under CSP, the gradient distribution of grain size is relatively uniform, whereas SSP leads to a pronounced gradient in grain size distribution. Taking into account the heterogeneous distribution of the initial material microstructure, a gradient in grain size from the surface to the interior of the material will appear after the coverage reaches a certain value, which is 400 % for AISI 9310 steel. Compared with CSP, SSP will further reduce the surface roughness Sa and improve the surface quality. The research presented further understands the relationship between shot peening process parameters and martensitic steel microstructure, providing an important reference for revealing the strengthening mechanism and selecting reasonable process parameters.</div></div>","PeriodicalId":22009,"journal":{"name":"Surface & Coatings Technology","volume":null,"pages":null},"PeriodicalIF":5.3000,"publicationDate":"2024-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface & Coatings Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0257897224010375","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}

引用次数: 0

Abstract

In this study, martensitic high-strength steel serves as the subject of investigation, with both conventional and severe shot peening experiments being conducted. The coverage levels for conventional shot peening (CSP) are set at 100 % and 200 %, while severe shot peening (SSP) sees levels of 800 % and 1200 %. For the first time, the use of kernel average misorientation (KAM) enables the calculation of geometrically necessary dislocation (GND) density after peening, facilitating the study of GND density distribution across different coverage and offering a method for the visual assessment of peening degree. Results reveal that, under CSP, the gradient distribution of grain size is relatively uniform, whereas SSP leads to a pronounced gradient in grain size distribution. Taking into account the heterogeneous distribution of the initial material microstructure, a gradient in grain size from the surface to the interior of the material will appear after the coverage reaches a certain value, which is 400 % for AISI 9310 steel. Compared with CSP, SSP will further reduce the surface roughness Sa and improve the surface quality. The research presented further understands the relationship between shot peening process parameters and martensitic steel microstructure, providing an important reference for revealing the strengthening mechanism and selecting reasonable process parameters.

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AISI 9310 钢中喷丸强化覆盖率与表面微观结构演变之间的相关性：EBSD 和表面形貌分析

本研究以马氏体高强度钢为研究对象，进行了常规和严重喷丸强化实验。传统喷丸强化（CSP）的覆盖水平设定为 100 % 和 200 %，而严重喷丸强化（SSP）的覆盖水平为 800 % 和 1200 %。首次使用核平均错位（KAM）来计算强化后的几何必要位错（GND）密度，有助于研究不同覆盖率下的 GND 密度分布，并提供了一种可视化评估强化程度的方法。结果表明，在 CSP 条件下，晶粒大小的梯度分布相对均匀，而 SSP 则导致晶粒大小的明显梯度分布。考虑到初始材料微观结构的异质分布，当覆盖率达到一定值（AISI 9310 钢的覆盖率为 400%）后，晶粒大小会从材料表面向内部渐变。与 CSP 相比，SSP 将进一步降低表面粗糙度 Sa 并改善表面质量。该研究进一步了解了喷丸强化工艺参数与马氏体钢显微组织之间的关系，为揭示强化机理和选择合理的工艺参数提供了重要参考。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Surface & Coatings Technology 工程技术-材料科学：膜

CiteScore

10.00

自引率

11.10%

发文量

921

审稿时长

19 days

期刊介绍： Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance: A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.