Multifunctional Thermal Interface Composites with Enhanced Thermal Conductivity, EMI Shielding Capabilities, and Mechanical Performance

IF 6.5 2区材料科学 Q1 MATERIALS SCIENCE, COMPOSITES

Composites Communications Pub Date : 2024-10-09 DOI:10.1016/j.coco.2024.102116

Yong Fan , Yongbin Wang , Jun Qiu

引用次数: 0

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具有更强导热性、EMI 屏蔽能力和机械性能的多功能热界面复合材料

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Composites Communications Materials Science-Ceramics and Composites

CiteScore

12.10

自引率

10.00%

发文量

340

审稿时长

36 days

期刊介绍： Composites Communications (Compos. Commun.) is a peer-reviewed journal publishing short communications and letters on the latest advances in composites science and technology. With a rapid review and publication process, its goal is to disseminate new knowledge promptly within the composites community. The journal welcomes manuscripts presenting creative concepts and new findings in design, state-of-the-art approaches in processing, synthesis, characterization, and mechanics modeling. In addition to traditional fiber-/particulate-reinforced engineering composites, it encourages submissions on composites with exceptional physical, mechanical, and fracture properties, as well as those with unique functions and significant application potential. This includes biomimetic and bio-inspired composites for biomedical applications, functional nano-composites for thermal management and energy applications, and composites designed for extreme service environments.