{"title":"A two-dimensional thin film structure with spectral selective emission capability suitable for high-temperature environments","authors":"","doi":"10.1016/j.csite.2024.105261","DOIUrl":null,"url":null,"abstract":"<div><div>Spectral selective emission materials, characterized by their high emission efficiency within specific wavelength ranges, play a crucial role in various fields such as infrared stealth and radiative cooling. In this study, leveraging the tunneling effect of ultrathin metal layers and the impedance matching principle, we designed a one-dimensional multilayer thin film structure composed of Mo/Ge/Al. This design successfully achieved spectral selective emission within the 3–14 μm infrared spectrum range, showcasing superior high-temperature infrared stealth capabilities. Research findings indicate that the infrared atmospheric window (ε<sub>3–5 μm</sub> = 0.40, ε<sub>8–14 μm</sub> = 0.30) maintains a low emissivity within the temperature range from room temperature to 400 °C, while high emissivity in non-infrared atmospheric windows (ε<sub>5–8 μm</sub> = 0.81) enables radiative cooling. The use of high emissivity in the non-infrared atmospheric window reduced the surface temperature of this structure by 15.3 °C compared to untreated Si substrate under similar heating conditions. The temperature reduction was 34.1 °C when compared to a Si substrate coated with a 200 nm Al film. This straightforward and easily scalable structure not only presents novel solutions for applications in infrared stealth and radiative cooling but also holds vast potential for diverse fields including military, aerospace, and industrial manufacturing, injecting fresh impetus and possibilities into technological advancement.</div></div>","PeriodicalId":9658,"journal":{"name":"Case Studies in Thermal Engineering","volume":null,"pages":null},"PeriodicalIF":6.4000,"publicationDate":"2024-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Case Studies in Thermal Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214157X24012929","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
Spectral selective emission materials, characterized by their high emission efficiency within specific wavelength ranges, play a crucial role in various fields such as infrared stealth and radiative cooling. In this study, leveraging the tunneling effect of ultrathin metal layers and the impedance matching principle, we designed a one-dimensional multilayer thin film structure composed of Mo/Ge/Al. This design successfully achieved spectral selective emission within the 3–14 μm infrared spectrum range, showcasing superior high-temperature infrared stealth capabilities. Research findings indicate that the infrared atmospheric window (ε3–5 μm = 0.40, ε8–14 μm = 0.30) maintains a low emissivity within the temperature range from room temperature to 400 °C, while high emissivity in non-infrared atmospheric windows (ε5–8 μm = 0.81) enables radiative cooling. The use of high emissivity in the non-infrared atmospheric window reduced the surface temperature of this structure by 15.3 °C compared to untreated Si substrate under similar heating conditions. The temperature reduction was 34.1 °C when compared to a Si substrate coated with a 200 nm Al film. This straightforward and easily scalable structure not only presents novel solutions for applications in infrared stealth and radiative cooling but also holds vast potential for diverse fields including military, aerospace, and industrial manufacturing, injecting fresh impetus and possibilities into technological advancement.
期刊介绍:
Case Studies in Thermal Engineering provides a forum for the rapid publication of short, structured Case Studies in Thermal Engineering and related Short Communications. It provides an essential compendium of case studies for researchers and practitioners in the field of thermal engineering and others who are interested in aspects of thermal engineering cases that could affect other engineering processes. The journal not only publishes new and novel case studies, but also provides a forum for the publication of high quality descriptions of classic thermal engineering problems. The scope of the journal includes case studies of thermal engineering problems in components, devices and systems using existing experimental and numerical techniques in the areas of mechanical, aerospace, chemical, medical, thermal management for electronics, heat exchangers, regeneration, solar thermal energy, thermal storage, building energy conservation, and power generation. Case studies of thermal problems in other areas will also be considered.