Microstructure and property evolution of CuCr50 alloy prepared by aluminum thermal reduction-electromagnetic casting during hot forging process

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2024-09-27 DOI:10.1016/j.matchar.2024.114400

Wang An , Zhi-he Dou , Ting-an Zhang , Jin-ru Han

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引用次数: 0

Abstract

To address the problems of low performance and density in CuCr50 alloys prepared by aluminum thermal reduction-electromagnetic casting, a synergistic process involving hot forging deformation to eliminate micropores in the alloy and heat treatment to modify the alloy was proposed. The effect of hot forging temperature on the microstructure evolution and performance strengthening of CuCr50 alloys during heat treatment was studied. The results show that the properties of CuCr50 alloys forged at different temperatures after heat treatment are better than those after direct heat treatment. After heat treatment, the conductivity of CuCr50 alloys forged at 800 °C reaches 22.41 MS/m, the density reaches 7.94 g/cm³, and the hardness reaches 112 HB, which are 73.59 %, 4.75 % and 37.59 % greater than those of the as-cast alloy, respectively. The microstructure analysis showed that the nano-Cr phase precipitated during the aging process of CuCr50 alloys after hot forging at 750 °C–850 °C had a semi-coherent relationship with the Cu matrix, which played a role in coherent strengthening. After hot forging at 900 °C, the precipitated Cr phase has an incoherent relationship with the Cu matrix, which played a role of dispersion strengthening. The performance test of 40.5 kV simulated vacuum interrupter shows that the breaking and chopping performance of the prepared CuCr50 contact material is obviously better than that of commercial products, which is expected to become a new process for the preparation of high performance CuCr contact materials.

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铝热还原-电磁铸造制备的 CuCr50 合金在热锻过程中的显微组织和性能演变

为解决铝热还原-电磁铸造制备的 CuCr50 合金的低性能和低密度问题，提出了一种协同工艺，即通过热锻变形消除合金中的微孔，并通过热处理对合金进行改性。研究了热锻温度对热处理过程中 CuCr50 合金微观结构演变和性能强化的影响。结果表明，不同温度下锻造的 CuCr50 合金经热处理后的性能优于直接热处理后的性能。热处理后，800 ℃锻造的 CuCr50 合金的电导率达到 22.41 MS/m，密度达到 7.94 g/cm3，硬度达到 112 HB，分别比铸造时的合金高 73.59 %、4.75 % 和 37.59 %。显微组织分析表明，750 ℃-850 ℃热锻后的 CuCr50 合金在时效过程中析出的纳米铬相与铜基体呈半相干关系，起到了相干强化的作用。在 900 ℃ 热锻后，析出的铬相与铜基体呈非相干关系，起到了分散强化的作用。40.5 kV 模拟真空灭弧室性能测试表明，制备的 CuCr50 触头材料的断裂和劈裂性能明显优于商用产品，有望成为制备高性能 CuCr 触头材料的新工艺。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.