Review on Solid-State Narrow and Wide-Band Power Amplifier

Abstract

This review paper examines the advancements in solid-state power amplifiers (SSPAs) for wireless communication technology. As mobile devices rely on efficient power amplifiers to maintain battery life and ensure clear signal transmission, fabrication technologies like complementary metal–oxide–semiconductor (CMOS) and gallium nitride (GaN) are revolutionizing power amplifier (PA) design. The choice of material depends on the working frequency, with gallium arsenide (GaAs) and GaN suitable for frequencies under 100 GHz, and indium phosphide reaching up to 500 GHz. However, cost is a crucial factor in industrial manufacturing, making CMOS technology advantageous for on-chip system integration. Millimeter-wave chips have different requirements based on their application scenarios. In the Ka-band (26.5–40 GHz), high-power GaN and GaAs chips are preferred for satellite and long-distance communication. In contrast, the 60 GHz band is suited for short-distance high-speed communication and consumer electronics, making lower-cost CMOS and germanium silicon devices the preferred choice. This paper explores critical design considerations for SSPAs, focusing on common structures like envelope tracking, Doherty amplifiers, envelope elimination and restoration, and various linearization methods. We provide a clear comparison of their strengths and weaknesses to empower readers to select the optimal SSPA structure for their needs. Our review aims to facilitate informed decisions in the development of efficient and cost-effective SSPAs for advancing wireless communication technology.