Performance of heat-resisting functional polypropylene/hollow silica substrates for 6th generation wireless communication

IF 2.6 4区 化学 Q3 POLYMER SCIENCE
Kai-ru Yang, Shuang Ouyang, Ning Ma, Tim Hsu, Ya-qiong Huang, Jen-taut Yeh
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引用次数: 0

Abstract

The effects of density and shape of hollow silica (functionalized silica hollow tubes (FSHT) or hollow glass microspheres (FHGM)) on dielectric constant (εr) and dielectric loss (tan δ) of hindered phenol (HP) grafted functional polypropylene (FPP)/FSHT, heat-treated FPP (HTFPP)/FSHT, FPP/FHGM or HTFPP/FHGM substrate films were systematically investigated. The dielectric or free-volume-hole characteristics of FPP/FSHT, FPP/FHGM, HTFPP/FSHT, or HTFPP/FHGM films decrease to a minimum, as FSHT or FHGM contents approach an optimal value of 4wt% or 8wt%, respectively, and their dielectric or free-volume-hole characteristics decrease or increase gradually with increasing HP molar%. The minimum εr and tan δ of FPP/FSHT or HTFPP/FSHT films decrease significantly with decreasing FSHT’s densities. By filling with 0.46 g/cm3 identical density of hollow silica fillers, the minimum εr or tan δ procured for FPP/FSHT or HTFPP/FSHT films are somewhat smaller than those of corresponding FPP/FHGM or HTFPP/FHGM films. The linear coefficient of thermal expansion (LCTE) or onset degradation temperature (DTonset) of FPP/FSHT, HTFPP/FSHT, FPP/FHGM or HTFPP/FHGM films reduce or increase visibly with increasing FSHT or FHGM contents, respectively. All DTonset values of HTFPP/hollow silica films are ~ 150℃ higher than those of conventional PP polymers. Satisfactorily low εr/tan δ (1.74/0.0019, 1.83/0.0020, 1.83/0.0024 and 1.92/0.0028 at 1 MHz), LCTE (95 × 10–6/℃, 89 × 10–6/℃, 80 × 10–6/℃ and 74 × 10–6/℃) and pleasing heat-resisting properties for 6G ultrarapid communication are acquired for properly prepared FPP/FSHT, HTFPP/FSHT FPP/FHGM or HTFPP/FHGM substrate films having 1.2 HP molar% and 0.46 g/cm3 density of FSHT and FHGM fillers. Probable reasons accounting for these reduced dielectric, LCTE and improved heat-resisting characteristics are proposed.

Abstract Image

用于第六代无线通信的耐热功能聚丙烯/中空二氧化硅基板的性能
系统研究了中空二氧化硅(功能化二氧化硅中空管(FSHT)或中空玻璃微球(FHGM))的密度和形状对受阻酚(HP)接枝功能聚丙烯(FPP)/FSHT、热处理 FPP(HTFPP)/FSHT、FPP/FHGM 或 HTFPP/FHGM 基底薄膜的介电常数(εr)和介电损耗(tan δ)的影响。当 FSHT 或 FHGM 的含量分别接近 4wt% 或 8wt% 的最佳值时,FPP/FSHT、FPP/FHGM、HTFPP/FSHT 或 HTFPP/FHGM 薄膜的介电特性或自由体积-空穴特性下降到最小值,并且它们的介电特性或自由体积-空穴特性随着 HP 摩尔% 的增加而逐渐下降或增加。随着 FSHT 密度的降低,FPP/FSHT 或 HTFPP/FSHT 薄膜的最小 εr 和 tan δ 显著减小。通过填充 0.46 g/cm3 相同密度的中空二氧化硅填料,FPP/FSHT 或 HTFPP/FSHT 薄膜得到的最小εr 或 tan δ略小于相应的 FPP/FHGM 或 HTFPP/FHGM 薄膜。随着 FSHT 或 FHGM 含量的增加,FPP/FSHT、HTFPP/FSHT、FPP/FHGM 或 HTFPP/FHGM 薄膜的线性热膨胀系数(LCTE)或起始降解温度(DTonset)分别明显降低或升高。HTFPP/ 中空二氧化硅薄膜的所有 DTonset 值都比传统 PP 聚合物高出约 150℃。εr/tanδ(1.74/0.0019、1.83/0.0020、1.83/0.0024 和 1.92/0.0028 at 1 MHz)、LCTE(95 × 10-6/℃、89 × 10-6/℃、80 × 10-6/℃和 74 × 10-6/℃)以及 6G 超高速通信的耐热性能。2 HP 摩尔%和 0.46 g/cm3 密度的 FSHT 和 FHGM 填料。提出了介电强度、LCTE 和耐热性能降低的可能原因。
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来源期刊
Journal of Polymer Research
Journal of Polymer Research 化学-高分子科学
CiteScore
4.70
自引率
7.10%
发文量
472
审稿时长
3.6 months
期刊介绍: Journal of Polymer Research provides a forum for the prompt publication of articles concerning the fundamental and applied research of polymers. Its great feature lies in the diversity of content which it encompasses, drawing together results from all aspects of polymer science and technology. As polymer research is rapidly growing around the globe, the aim of this journal is to establish itself as a significant information tool not only for the international polymer researchers in academia but also for those working in industry. The scope of the journal covers a wide range of the highly interdisciplinary field of polymer science and technology, including: polymer synthesis; polymer reactions; polymerization kinetics; polymer physics; morphology; structure-property relationships; polymer analysis and characterization; physical and mechanical properties; electrical and optical properties; polymer processing and rheology; application of polymers; supramolecular science of polymers; polymer composites.
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