A D-Band Self-Packaged Low Loss Grounded Coplanar Waveguide to Rectangular Waveguide Transition With Silicon-Based Air Cavity-Backed Structure

Abstract

A novel D-band self-packaged silicon-based air cavity-backed transition from grounded coplanar waveguide to air-filled rectangular waveguide was investigated, fabricated, and measured in this work. The equivalent circuit model was established and analyzed in detail, and design procedures are given. The calculated, simulated, and measured S-parameters of the transition show some agreement. The minimum measured insertion loss of the proposed transition is 1.1 dB at 147 GHz with a fractional 3-dB bandwidth of 10.2%. This transition demonstrates outstanding performance of low loss and profile compared with state-of-the art works in our in-house silicon-based MEMS photosensitive composite film fabrication process. It can be further used in a high-performance joint radar communication system in packaging.