Simulation modeling of wafer grinding surface roughness considering grinding vibration

IF 3.5 2区工程技术 Q2 ENGINEERING, MANUFACTURING

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology Pub Date : 2024-09-12 DOI:10.1016/j.precisioneng.2024.09.002

Meng Li, Xianglong Zhu, Renke Kang, Jiasheng Li, Jiahui Xu, Tianyu Li

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Abstract

When using the workpiece rotation method to grind wafers, the grinding end vibration will deteriorate the surface roughness of the wafers. To study the impact law of vibration on the surface roughness of wafers during the grinding procedure, this paper presents a new approach to simulate and model the surface roughness of wafer grinding considering the grinding vibration. Firstly, the dynamics model under the consideration of grinding force was established for the grinding end of the grinding wheel and workpiece turntable. Secondly, using the iterative method to solve the dynamic equations that have been established, the vibration equation is obtained by fitting the displacement vibration curve of the end. Then, by reconstructing the surface grain of the gear teeth, a simulation model of wafer grinding surface roughness was established considering material removal, grain motion and grinding vibration. And then the grinding comparison test was conducted to compare the simulation and test surface roughness measurement results. The maximum deviation of the surface roughness Sz and Sa was 7.7 % and 5.4 %, respectively. The results indicate the accuracy of the modeling. Finally, based on the established wafer roughness model, explore the impact of vibration on wafer roughness during the grinding procedure. This model provides a reference for the research of wafer precision grinding technology.

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考虑磨削振动的晶片磨削表面粗糙度仿真建模

在使用工件旋转法磨削晶片时，磨削端的振动会使晶片的表面粗糙度变差。为了研究磨削过程中振动对晶片表面粗糙度的影响规律，本文提出了一种考虑磨削振动的晶片磨削表面粗糙度模拟和建模新方法。首先，针对砂轮磨削端和工件转盘建立了考虑磨削力的动力学模型。其次，利用迭代法求解已建立的动力学方程，通过拟合磨端位移振动曲线得到振动方程。然后，通过重构齿轮齿面晶粒，建立了考虑材料去除、晶粒运动和磨削振动的晶片磨削表面粗糙度仿真模型。然后进行磨削对比试验，比较模拟和试验的表面粗糙度测量结果。表面粗糙度 Sz 和 Sa 的最大偏差分别为 7.7 % 和 5.4 %。结果表明了建模的准确性。最后，基于已建立的晶片粗糙度模型，探讨了研磨过程中振动对晶片粗糙度的影响。该模型为晶圆精密磨削技术的研究提供了参考。

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来源期刊

Precision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology 工程技术-工程：制造

CiteScore

7.40

自引率

5.60%

发文量

177

审稿时长

46 days

期刊介绍： Precision Engineering - Journal of the International Societies for Precision Engineering and Nanotechnology is devoted to the multidisciplinary study and practice of high accuracy engineering, metrology, and manufacturing. The journal takes an integrated approach to all subjects related to research, design, manufacture, performance validation, and application of high precision machines, instruments, and components, including fundamental and applied research and development in manufacturing processes, fabrication technology, and advanced measurement science. The scope includes precision-engineered systems and supporting metrology over the full range of length scales, from atom-based nanotechnology and advanced lithographic technology to large-scale systems, including optical and radio telescopes and macrometrology.