Post-growth annealing effect of Li-doped NiO thin films grown by mist chemical vapor deposition

IF 3.9 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Min-Seong Kong , Min-Su Park , Si-Young Bae
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Abstract

Nickel oxide (NiO) thin films were grown by mist chemical vapor deposition (mist CVD) with various amounts of Li dopant in the precursor (0–15%). As the Li dopant readily decomposed under the high temperature above 700 °C, the post-growth annealing was conducted at 600–800 °C. The crystal quality of the undoped and Li-doped NiO films was improved by thermal annealing due to the crystal reconstruction. The optical transmittance of NiO films was decreased with increasing the amounts of Li dopants, whereas it was increased with thermal annealing. The bandgap of the NiO films was slightly red-shifted with increased amounts of Li dopants, whereas it was blue-shifted with increasing annealing temperature. The resistivity of as-grown NiO films ranged from 25–75 Ω·cm with Li doping. Electrical properties abruptly decreased under a high annealing temperature of 700 °C. Hence, an appropriate combination of Li doping and post-growth annealing might improve the structural properties of the NiO thin films while retaining the p-type conductivity.
雾状化学气相沉积法生长的掺锂氧化镍薄膜的生长后退火效应
氧化镍(NiO)薄膜是通过雾状化学气相沉积法(雾状 CVD)生长的,前驱体中掺杂了不同量的锂(0-15%)。由于锂掺杂剂在 700 °C 以上的高温下容易分解,因此生长后的退火温度为 600-800 °C。由于晶体重构,热退火改善了未掺杂和掺锂氧化镍薄膜的晶体质量。随着掺锂量的增加,NiO 薄膜的光学透射率降低,而热退火则提高了光学透射率。随着掺杂锂元素数量的增加,NiO 薄膜的带隙发生了轻微的红移,而随着退火温度的升高,带隙发生了蓝移。随着锂掺杂量的增加,生长的氧化镍薄膜的电阻率在 25-75 Ω-cm 之间。在 700 °C 的高退火温度下,电性能突然下降。因此,掺杂锂和生长后退火的适当结合可能会改善氧化镍薄膜的结构特性,同时保留其 p 型导电性。
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来源期刊
CiteScore
5.60
自引率
2.80%
发文量
481
审稿时长
3.5 months
期刊介绍: The journal provides an international medium for the publication of theoretical and experimental studies and reviews related to the electronic, electrochemical, ionic, magnetic, optical, and biosensing properties of solid state materials in bulk, thin film and particulate forms. Papers dealing with synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics are viewed as suitable for publication. Articles focused on nano-structured aspects of these advanced solid-state materials will also be considered suitable.
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