Low-dielectric thermosetting resins derived from polysaccharide unsaturated esters

IF 6.3 2区化学 Q1 POLYMER SCIENCE

Polymer Degradation and Stability Pub Date : 2024-09-20 DOI:10.1016/j.polymdegradstab.2024.111011

Yuya Fukata, Satoshi Kimura, Tadahisa Iwata

{"title":"Low-dielectric thermosetting resins derived from polysaccharide unsaturated esters","authors":"Yuya Fukata, Satoshi Kimura, Tadahisa Iwata","doi":"10.1016/j.polymdegradstab.2024.111011","DOIUrl":null,"url":null,"abstract":"<div><div>Printed circuit boards (PCBs) contain metals and plastics, with the latter often incinerated after disposal, leading to carbon dioxide emissions. This study focuses on developing biomass-based thermosetting resins derived from polysaccharides. Cellulose and α-1,3-glucan were introduced with unsaturated (2-butenoate) and saturated (hexanoate) ester groups to achieve appropriate properties for PCB applications. The synthesized polysaccharide esters, cellulose-2-butenoate-hexanoate and α-1,3-glucan-2-butenoate-hexanoate, demonstrated thermoformability at 150 °C, suitable for being laminated on circuit lines. After heating at 220 °C for 1 hour, the unsaturated parts of the polymers crosslinked, increasing the glass transition temperature to over 230 °C, making them potentially durable for the soldering process. The dielectric constant and dissipation factor of the crosslinked resins ranged from 2.5 to 2.7 and 0.012 to 0.014, respectively, outperforming conventional epoxy resins to reduce transmission loss. Additionally, the crosslinked films exhibited robust mechanical properties with tensile strengths exceeding 50 MPa. These results indicate that polysaccharide unsaturated esters are promising for use as PCB insulating resins, providing a sustainable alternative to petroleum-based materials.</div></div>","PeriodicalId":406,"journal":{"name":"Polymer Degradation and Stability","volume":"230 ","pages":"Article 111011"},"PeriodicalIF":6.3000,"publicationDate":"2024-09-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Degradation and Stability","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0141391024003550","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}

引用次数: 0

Abstract

Printed circuit boards (PCBs) contain metals and plastics, with the latter often incinerated after disposal, leading to carbon dioxide emissions. This study focuses on developing biomass-based thermosetting resins derived from polysaccharides. Cellulose and α-1,3-glucan were introduced with unsaturated (2-butenoate) and saturated (hexanoate) ester groups to achieve appropriate properties for PCB applications. The synthesized polysaccharide esters, cellulose-2-butenoate-hexanoate and α-1,3-glucan-2-butenoate-hexanoate, demonstrated thermoformability at 150 °C, suitable for being laminated on circuit lines. After heating at 220 °C for 1 hour, the unsaturated parts of the polymers crosslinked, increasing the glass transition temperature to over 230 °C, making them potentially durable for the soldering process. The dielectric constant and dissipation factor of the crosslinked resins ranged from 2.5 to 2.7 and 0.012 to 0.014, respectively, outperforming conventional epoxy resins to reduce transmission loss. Additionally, the crosslinked films exhibited robust mechanical properties with tensile strengths exceeding 50 MPa. These results indicate that polysaccharide unsaturated esters are promising for use as PCB insulating resins, providing a sustainable alternative to petroleum-based materials.

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多糖不饱和酯衍生的低介电热固性树脂

印刷电路板（PCB）含有金属和塑料，后者通常在废弃后被焚烧，从而导致二氧化碳排放。本研究的重点是开发从多糖中提取的生物质热固性树脂。在纤维素和 α-1,3-葡聚糖中引入了不饱和（2-丁烯酸酯）和饱和（己酸酯）酯基，以获得适合多氯联苯应用的特性。合成的多糖酯（纤维素-2-丁烯酸己酸酯和α-1,3-葡聚糖-2-丁烯酸己酸酯）在 150 ℃ 下具有热成型性，适合层压在电路板上。在 220 ℃ 下加热 1 小时后，聚合物的不饱和部分发生交联，使玻璃化转变温度升至 230 ℃ 以上，从而使其在焊接过程中具有潜在的耐久性。交联树脂的介电常数和耗散因子分别为 2.5 至 2.7 和 0.012 至 0.014，在降低传输损耗方面优于传统的环氧树脂。此外，交联薄膜还具有良好的机械性能，拉伸强度超过 50 兆帕。这些结果表明，多糖不饱和酯有望用作印刷电路板绝缘树脂，为石油基材料提供了一种可持续的替代品。

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来源期刊

Polymer Degradation and Stability 化学-高分子科学

CiteScore

10.10

自引率

10.20%

发文量

325

审稿时长

23 days

期刊介绍： Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology. Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal. However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.