Study on the growth kinetics of Ag3Sn alloy layer and fatigue lifetime prediction of PV interconnection

IF 6.3 2区材料科学 Q2 ENERGY & FUELS

Solar Energy Materials and Solar Cells Pub Date : 2024-09-28 DOI:10.1016/j.solmat.2024.113186

Jun Chen, Yan Li, Chentong Zhang, Liuqing Huang, Xuetao Luo

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引用次数: 0

Abstract

The electrical conductivity and reliability performances of modules remains a challenge for extending the life-cycling in the widely practical crystalline silicon photovoltaic. Photovoltaic module reliability is severely destroyed by the stress accumulation resulted from the non-stop growth of Ag₃Sn intermetallic compounds at the solder joint. The growth behavior and microstructural evolution of Ag₃Sn intermetallic compounds during continuous aging was thoroughly investigated, which provided a method for predicting the fatigue life of solder joints. The results indicated that the Ag₃Sn intermetallic compounds at the solder joint were formed by continuous diffusion between the brazing material and the Ag electrode in a porous silver electrode, which was significantly affected by temperature and time. When the stress of Ag₃Sn intermetallic compounds was less than 26.7 MPa, the equivalent Ag₃Sn thickness was greater than 1.67 μm. During the soldering process, a reasonable soldering force of 1.44 N was required, corresponding to an initial Ag₃Sn thickness of 1.67–3.02 μm. Moreover, the growth of the intermetallic compounds layer was found to be logarithmic with respect to time and exponential with temperature. Based on the dynamic model of Ag₃Sn and outdoor temperature data of typical cities in Munich, Taizhou, and Sydney with variable latitudes, the fatigue life of solder joints was accurately predicted through finite element analysis. The work provides a theoretical foundation for the precise categorization of photovoltaic modules in diverse applications.

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Ag3Sn 合金层的生长动力学研究与光伏互连的疲劳寿命预测

在广泛实用的晶体硅光伏技术中，组件的导电性和可靠性能仍然是延长使用寿命的一个挑战。由于 Ag3Sn 金属间化合物在焊点处不断生长，导致应力累积，严重破坏了光伏组件的可靠性。对 Ag3Sn 金属间化合物在连续老化过程中的生长行为和微结构演变进行了深入研究，为预测焊点的疲劳寿命提供了一种方法。结果表明，焊点处的 Ag3Sn 金属间化合物是在多孔银电极中通过钎料和银电极之间的持续扩散形成的，受温度和时间的影响很大。当 Ag3Sn 金属间化合物的应力小于 26.7 MPa 时，等效 Ag3Sn 厚度大于 1.67 μm。在焊接过程中，需要 1.44 N 的合理焊接力，对应的初始 Ag3Sn 厚度为 1.67-3.02 μm。此外，还发现金属间化合物层的增长与时间呈对数关系，与温度呈指数关系。根据 Ag3Sn 的动态模型以及慕尼黑、台州和悉尼等典型城市不同纬度的室外温度数据，通过有限元分析准确预测了焊点的疲劳寿命。这项研究为光伏组件在不同应用领域的精确分类提供了理论基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Solar Energy Materials and Solar Cells 工程技术-材料科学：综合

CiteScore

12.60

自引率

11.60%

发文量

513

审稿时长

47 days

期刊介绍： Solar Energy Materials & Solar Cells is intended as a vehicle for the dissemination of research results on materials science and technology related to photovoltaic, photothermal and photoelectrochemical solar energy conversion. Materials science is taken in the broadest possible sense and encompasses physics, chemistry, optics, materials fabrication and analysis for all types of materials.