Effect of wheat bran filler particulates nettle fiber reinforced epoxy matrix composite − A novel material for thermal insulation application

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2024-10-01 DOI:10.1016/j.tsep.2024.102917

Chenyoushi Xu , Manzoore Elahi M. Soudagar , Pradeep Kumar Singh , Muhammad Nasir Bashir , Joon Sang Lee , Mohammad Rezaul Karim , Asiful H. Seikh

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Abstract

This research examines the mechanical and thermal characteristics of composites made from nettle fiber-reinforced wheat bran filler particulate epoxy framework. It highlights the influence of different filler materials on the performance of these composites. A thorough examination of mechanical properties was carried out, focusing on the flexibility, bending strength, impact resistance, and Shore D hardness. The malleable quality was completely changed by adding a filler ingredient, reaching a peak of 51.36 MPa. The flexural strength reached 47.38 MPa, showing excellent ability to withstand loads. The assessment of affect quality reached a maximum of 13 kJ/m2, indicating high energy absorption and durability. The Shore D hardness, which indicates the surface’s ability to resist indentation, ranged from 52 to 61, indicating differences in the stiffness of the composite material. The addition of bran filler to this composite provides an ideal thermal conductivity value of 0.98 W/mK. The morphological properties of the composites were analysed using Scanning Electron Microscopy (SEM), which provided detailed insights into their internal structure. The SEM images revealed a uniform distribution of nettle filaments and bran fillers inside the epoxy matrix, with well-formed samples exhibiting strong fiber–matrix adhesion and minimal voids.

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麦麸填料微粒对荨麻纤维增强环氧基复合材料的影响--一种用于隔热应用的新型材料

本研究探讨了由荨麻纤维增强麦麸填料颗粒环氧框架制成的复合材料的机械和热特性。研究强调了不同填充材料对这些复合材料性能的影响。研究对机械性能进行了全面检测，重点是柔韧性、弯曲强度、抗冲击性和邵氏 D 硬度。添加填料成分后，可塑性质量完全改变，达到了 51.36 兆帕的峰值。抗弯强度达到了 47.38 兆帕，显示出卓越的承载能力。抗冲击质量的评估结果达到了 13 kJ/m2 的最大值，表明具有较高的能量吸收能力和耐久性。邵氏 D 硬度（表示表面的抗压痕能力）从 52 到 61 不等，表明复合材料的硬度存在差异。在这种复合材料中加入麸皮填料后，理想的导热值为 0.98 W/mK。使用扫描电子显微镜（SEM）分析了复合材料的形态特性，详细了解了其内部结构。扫描电子显微镜图像显示，荨麻丝和糠麸填料在环氧树脂基体中分布均匀，成型良好的样品显示出很强的纤维与基体粘附性，空隙极小。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.