Overcoming bubble formation in polydimethylsiloxane-made PCR chips: mechanism and elimination with a high-pressure liquid seal.

IF 7.3 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION
Shiyuan Gao, Tiegang Xu, Lei Wu, Xiaoyue Zhu, Xuefeng Wang, Xiaohong Jian, Xinxin Li
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引用次数: 0

Abstract

The thermal expansion of gas and the air permeability of polydimethylsiloxane (PDMS) were previously thought to be the main causes of bubbles and water loss during polymerase chain reaction (PCR), resulting in a very complex chip design and operation. Here, by calculating and characterizing bubble formation, we discovered that water vapor is the main cause of bubbling. During PCR, heat increases the volume of the bubble by a factor of only ~0.2 in the absence of water vapor but by a factor of ~6.4 in the presence of water vapor. In addition, the phenomenon of "respiration" due to the repeated evaporation and condensation of water vapor accelerates the expansion of bubbles and the loss of water. A water seal above 109 kPa can effectively prevent bubbles in a bare PDMS chip with a simple structure, which is significant for the wide application of PDMS chips.

克服聚二甲基硅氧烷 PCR 芯片中气泡的形成:高压液体密封的机理与消除。
以前人们认为气体的热膨胀和聚二甲基硅氧烷(PDMS)的透气性是聚合酶链式反应(PCR)过程中产生气泡和失水的主要原因,导致芯片设计和操作非常复杂。在这里,通过对气泡形成的计算和表征,我们发现水蒸气才是产生气泡的主要原因。在 PCR 过程中,如果没有水蒸气,热量只会使气泡体积增大约 0.2 倍,但如果有水蒸气,则会增大约 6.4 倍。此外,由于水蒸气反复蒸发和凝结而产生的 "呼吸 "现象也加速了气泡的膨胀和水分的流失。109 kPa 以上的水封可有效防止结构简单的裸 PDMS 芯片产生气泡,这对 PDMS 芯片的广泛应用意义重大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
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