Low-Energy Dissipation Diamond MEMS

IF 14 Q1 CHEMISTRY, MULTIDISCIPLINARY
Guo Chen, Satoshi Koizumi, Yasuo Koide and Meiyong Liao*, 
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引用次数: 0

Abstract

Microelectromechanical systems (MEMS) that integrate tiny mechanical devices with electronics on a semiconductor substate have experienced explosive growth over the past decades. MEMS have a range of wide applications from accelerometers and gyroscopes in automotive safety, to precise reference oscillators in consumer electrons to probes in atomic force microscopy and sensors for gravitational wave detection. The quality (Q)-factor is a fundamental parameter of a MEMS resonator that determines the sensitivity, noise level, energy efficiency, and stability of the device. MEMS with low energy dissipation have always been pursued. Despite the brilliant progress of silicon-based MEMS due to the mature technology in counterpart microelectronics, the intrinsic material properties limit the sensitivity and reliability, especially for the applications under extreme conditions. Diamond has emerged as the ideal semiconductor material for low-energy dissipation MEMS with high performance and high reliability, owing to its unparalleled material properties, such as extremely high mechanical strength, superelectrical properties, highest thermal conductivity, and chemical inertness. Diamond resonators are thus expected to exhibit high Q-factors, and high reliability, with low thermomechanical force noise and long coherence rate of mechanical quantum states, not only improving the performance of MEMS devices but also expanding to the quantum domain. Single-crystal diamond (SCD) is desirable to achieve the ultralow energy loss or high Q-factor MEMS resonator due to the nonexistence of grain boundaries and other carbon phases. However, micromachining for SCD is tough and heteroepitaxial growth of SCD on foreign substrates remains quite difficult.

In this Account, we provide an overview of the recent research and strategies in SCD diamond MEMS for achieving high Q-factors, focusing on those fabricated by the smart-cut method developed in our lab. We start with the concept of diamond MEMS, covering structure fabrication, fundamentals, and applications. A comprehensive discussion of the energy dissipation mechanisms on the Q-factors in diamond MEMS resonators is provided. The approaches to enhance the Q-factor of diamond resonators including (1) the growth of high crystal quality SCD epilayer on the ion-implanted substrate, (2) defects engineering, and (3) strain engineering by thinning the resonator to around 100 nm thick are presented. In the smart-cut method, the ∼100 nm thick defective layer contributes to the main intrinsic energy loss. By combing the growth of a high crystal quality diamond epilayer above the defective layer and the atomic scale etching of the defective layer, the Q-factors could be improved from thousands to over one million at room temperature, the highest among all the semiconductors. The intrinsic high Q-factors of SCD MEMS are also due to the well-controlled purity of the diamond epilayer and the ultrawide bandgap energy of diamond. Through strain engineering of the SCD MEMS beam to nanoscale, the Q-factor is expected to be further enhanced. These strategies represent pivotal steps in advancing the performance and applicability of diamond MEMS resonators.

Abstract Image

低能量消耗钻石微机电系统
微机电系统(MEMS)将微小的机械装置与电子器件集成在半导体基板上,在过去几十年中经历了爆炸式的增长。从汽车安全领域的加速计和陀螺仪,到消费电子领域的精确基准振荡器,再到原子力显微镜探头和引力波探测传感器,MEMS 的应用范围十分广泛。质量(Q)因子是 MEMS 谐振器的基本参数,它决定了器件的灵敏度、噪声水平、能效和稳定性。人们一直在追求低能耗的 MEMS。尽管硅基 MEMS 因其成熟的微电子技术而取得了辉煌的成就,但其内在的材料特性限制了其灵敏度和可靠性,尤其是在极端条件下的应用。金刚石具有无与伦比的材料特性,如极高的机械强度、超电特性、最高的热导率和化学惰性,因此已成为高性能、高可靠性的低能量消耗微机电系统的理想半导体材料。因此,金刚石谐振器有望表现出高 Q 值系数、高可靠性、低热机械力噪声和机械量子态长相干速率,不仅能提高 MEMS 器件的性能,还能扩展到量子领域。由于不存在晶界和其他碳相,单晶金刚石(SCD)是实现超低能量损耗或高 Q 因子 MEMS 谐振器的理想材料。然而,SCD 的微加工非常困难,而且在国外基底上异质外延生长 SCD 仍然相当困难。在本报告中,我们概述了最近在实现高 Q 因子的 SCD 金刚石 MEMS 方面的研究和策略,重点介绍了我们实验室开发的智能切割法制造的 SCD 金刚石 MEMS。我们首先介绍了金刚石微机电系统的概念,包括结构制造、基本原理和应用。我们全面讨论了金刚石 MEMS 谐振器 Q 因子的能量耗散机制。介绍了提高金刚石谐振器 Q 因子的方法,包括 (1) 在离子注入基底上生长高晶体质量的 SCD 表层;(2) 缺陷工程;以及 (3) 通过将谐振器减薄至约 100 nm 厚的应变工程。在智能切割法中,厚度为 100 nm 的缺陷层造成了主要的内在能量损失。通过在缺陷层上生长高晶体质量的金刚石外延层和对缺陷层进行原子级蚀刻,室温下的 Q 值系数可从数千提高到一百万以上,是所有半导体中最高的。SCD MEMS 固有的高 Q 因子还得益于金刚石外延层的纯度控制良好以及金刚石的超宽带隙能。通过对 SCD MEMS 梁进行纳米级应变工程,Q 系数有望进一步提高。这些策略是提高金刚石 MEMS 谐振器性能和适用性的关键步骤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
17.70
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