Multilayer Graphene Strips on Insulators Formed by Layer Exchange for Applications as Interconnects

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Hiromasa Murata*, Takamitsu Ishiyama, Katsuhisa Murakami, Masayoshi Nagao and Kaoru Toko*, 
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Abstract

Multilayer graphene (MLG) has attracted considerable attention as an interconnect material owing to its excellent electrical and mechanical properties. Several studies on the formation of MLG on insulators have been reported; however, the process temperature and shape controllability of MLG remain challenging. In this study, we investigated the formation of MLG strips for interconnect via metal-induced layer exchange (LE). The LE of strip-patterned amorphous carbon and Ni formed {002}-oriented high-crystallinity MLG strips at low temperatures (600 °C). While voids were formed inside the strip, continuous MLG was formed at the strip edge, likely due to the remarkable atomic diffusion at the edge. Smaller widths and larger thicknesses of the MLG strip allowed us to form uniform MLG strips without voids, and an electrical conductivity of 1100 S cm–1 was achieved. The technique developed in this study is unique because it overcomes the limitations of conventional MLG fabrication techniques and is promising for MLG interconnect applications.

Abstract Image

通过层交换在绝缘体上形成的多层石墨烯带,可用作互连器件
多层石墨烯(MLG)因其优异的电气和机械性能而作为一种互连材料备受关注。关于在绝缘体上形成多层石墨烯的多项研究已经有了报道;然而,多层石墨烯的工艺温度和形状可控性仍然具有挑战性。在本研究中,我们研究了通过金属诱导层交换(LE)形成用于互连的 MLG 条带。在低温(600 °C)下,条状图案的无定形碳和镍的层交换形成了{002}取向的高结晶度 MLG 带材。虽然在带材内部形成了空隙,但在带材边缘却形成了连续的 MLG,这可能是由于边缘处显著的原子扩散。较小宽度和较大厚度的 MLG 带材使我们能够形成无空隙的均匀 MLG 带材,并实现了 1100 S cm-1 的导电率。本研究中开发的技术是独一无二的,因为它克服了传统 MLG 制造技术的局限性,在 MLG 互连应用中大有可为。
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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