Strengthening mechanisms and research progress in the W/Cu interfaces

IF 4.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Lai-Ma Luo , Xi-Peng Ding , Wang-Zhi Xu , Cai-Yan Wang , Yong-Qiang Qin , Yu-Cheng Wu
{"title":"Strengthening mechanisms and research progress in the W/Cu interfaces","authors":"Lai-Ma Luo ,&nbsp;Xi-Peng Ding ,&nbsp;Wang-Zhi Xu ,&nbsp;Cai-Yan Wang ,&nbsp;Yong-Qiang Qin ,&nbsp;Yu-Cheng Wu","doi":"10.1016/j.ijrmhm.2024.106900","DOIUrl":null,"url":null,"abstract":"<div><div>Tungsten‑copper (W<img>Cu) composites integrate the high melting point, strength, and superior wear and arc resistance of tungsten with the exceptional electrical and thermal conductivity and good plasticity of copper. This combination makes them ideal for applications requiring high thermal conductivity and resistance to high temperatures. However, producing high-quality composites is challenging due to the significant differences in crystal structure and physical properties between tungsten and copper. Under high temperature load conditions, the W<img>Cu interface is subjected to substantial thermal stresses, which can lead to crack formation and eventual material failure. This review systematically analyzes methods to enhance the bonding strength of the W/Cu interface, suppress crack initiation and propagation, and mitigate interface thermal stresses. The focus is on physical bonding, chemical bonding, and the design and preparation of W<img>Cu functionally graded materials (FGMs). The mechanisms for strengthening the W/Cu interface are elucidated. Additionally, this review addresses the effects of grain refinement and work hardening at the interface on the microstructure and overall properties of W<img>Cu composites. Finally, the review summarizes the prospects for W/Cu interface research and highlights the challenges for future investigations.</div></div>","PeriodicalId":14216,"journal":{"name":"International Journal of Refractory Metals & Hard Materials","volume":"125 ","pages":"Article 106900"},"PeriodicalIF":4.2000,"publicationDate":"2024-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Refractory Metals & Hard Materials","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0263436824003482","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Tungsten‑copper (WCu) composites integrate the high melting point, strength, and superior wear and arc resistance of tungsten with the exceptional electrical and thermal conductivity and good plasticity of copper. This combination makes them ideal for applications requiring high thermal conductivity and resistance to high temperatures. However, producing high-quality composites is challenging due to the significant differences in crystal structure and physical properties between tungsten and copper. Under high temperature load conditions, the WCu interface is subjected to substantial thermal stresses, which can lead to crack formation and eventual material failure. This review systematically analyzes methods to enhance the bonding strength of the W/Cu interface, suppress crack initiation and propagation, and mitigate interface thermal stresses. The focus is on physical bonding, chemical bonding, and the design and preparation of WCu functionally graded materials (FGMs). The mechanisms for strengthening the W/Cu interface are elucidated. Additionally, this review addresses the effects of grain refinement and work hardening at the interface on the microstructure and overall properties of WCu composites. Finally, the review summarizes the prospects for W/Cu interface research and highlights the challenges for future investigations.
加强 W/Cu 界面的机制和研究进展
钨-铜(WCu)复合材料将钨的高熔点、高强度、优异的耐磨性和耐电弧性与铜的优异导电性、导热性和良好的可塑性融为一体。这种组合使其非常适合需要高导热性和耐高温的应用。然而,由于钨和铜在晶体结构和物理性能方面存在显著差异,生产高质量的复合材料具有挑战性。在高温负载条件下,钨铜界面会承受巨大的热应力,从而导致裂纹的形成和材料的最终失效。本综述系统分析了增强钨/铜界面结合强度、抑制裂纹产生和扩展以及减轻界面热应力的方法。重点是物理键合、化学键合以及 WCu 功能分级材料 (FGM) 的设计和制备。本综述阐明了强化 W/Cu 界面的机制。此外,本综述还探讨了晶粒细化和界面加工硬化对 WCu 复合材料微观结构和整体性能的影响。最后,综述总结了 W/Cu 界面研究的前景,并强调了未来研究面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
7.00
自引率
13.90%
发文量
236
审稿时长
35 days
期刊介绍: The International Journal of Refractory Metals and Hard Materials (IJRMHM) publishes original research articles concerned with all aspects of refractory metals and hard materials. Refractory metals are defined as metals with melting points higher than 1800 °C. These are tungsten, molybdenum, chromium, tantalum, niobium, hafnium, and rhenium, as well as many compounds and alloys based thereupon. Hard materials that are included in the scope of this journal are defined as materials with hardness values higher than 1000 kg/mm2, primarily intended for applications as manufacturing tools or wear resistant components in mechanical systems. Thus they encompass carbides, nitrides and borides of metals, and related compounds. A special focus of this journal is put on the family of hardmetals, which is also known as cemented tungsten carbide, and cermets which are based on titanium carbide and carbonitrides with or without a metal binder. Ceramics and superhard materials including diamond and cubic boron nitride may also be accepted provided the subject material is presented as hard materials as defined above.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信