Optimization of Source Modeling From Phaseless Near-Field Scanning Based on SVD-Defined Eigenmodes

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Min-Hsu Tsai;Hong-Wen Qian;Wei-Kai Chen;Ming-Chung Huang;Jen-Chieh Liu;Ruey-Beei Wu
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引用次数: 0

Abstract

This article proposes a procedure for reconstructing dipole moment models from magnitude-only near-field scanned magnetic fields. Preprocessing uses a finite-impulse response filter to deblur the 2-D divergence of the magnetic fields to locate the dipoles. The procedure defines the modes of the dipole distribution using singular value decomposition. Based on mode decomposition, the modal coefficients are optimized through a pattern search algorithm to obtain the dipole moments. Compared with existing methods, this method reconstructs better phase information in high-noise situations. Using mode decomposition circumvents the problem of a limited number of dipoles that can be solved by existing optimization methods. Real experiments using high-resolution near-field scanned data show that the main emission sources of individual traces inside an integrated circuit (IC) chip can be distinguished through the proposed procedure.
基于 SVD 定义特征模式的无相近场扫描源建模优化
本文提出了一种用仅震级的近场扫描磁场重建偶极矩模型的方法。预处理使用有限脉冲响应滤波器去模糊磁场的二维发散以定位偶极子。该程序使用奇异值分解定义了偶极子分布的模式。在模态分解的基础上,通过模式搜索算法对模态系数进行优化,得到偶极矩。与现有方法相比,该方法在高噪声环境下重构出更好的相位信息。使用模态分解可以避免现有优化方法所能解决的偶极子数量有限的问题。利用高分辨率近场扫描数据进行的实际实验表明,该方法可以区分集成电路(IC)芯片内单个走线的主要发射源。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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