Y.H. Zhong , X.L. Han , H.Q. Yun , B. Mei , Y.B. Su , Z. Jin , C. Zhang
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引用次数: 0
Abstract
This paper has proposed a novel radiation effects modeling methodology based on neural networks for InP-based high-electron-mobility transistors (HEMTs). 2 MeV proton radiation has been performed with dose of 1 × 1012 H+/cm2, 5 × 1012 H+/cm2, 1 × 1013 H+/cm2, 5 × 1013 H+/cm2, 1 × 1014 H+/cm2. The radiation neural network models were comparatively constructed based on Feedforward Neural Network (FNN), Recurrent Neural Network (RNN), and Long Short-Term Memory (LSTM). Results indicate that the LSTM network outperforms the FNN and RNN networks in the modeling for both drain-source current (IDS) and S-parameters, which demonstrates superior prediction accuracy with smaller fitting error. The proposed modeling approach offers an accurate characterization for the radiation effects of InP-based HEMT devices, without the need to consider the complex degradation process associated with radiation, thus providing practical guidelines for the space applications of such devices.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.