Finite element analysis and experimental study on the cutting mechanism of SiCp/Al composite in laser ultrasonic elliptic vibration turning

IF 3.7 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Today Communications Pub Date : 2024-09-12 DOI:10.1016/j.mtcomm.2024.110389

Chenyang Xia, Jieqiong Lin, Mingming Lu, Xuejian Zhang, Shuang Chen

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引用次数: 0

Abstract

SiCp/Al composites have excellent material properties and are increasingly being used in the aerospace, military, and electronic packaging industries. However, the inhomogeneity and non-conductivity of conventional turning (CT) results in poor material surface quality and high cutting forces, which seriously hinder the application of particlereinforced metal matrix composites. The thermal softening property of laser-assisted turning (LAT) and the intermittent cutting property of two-dimensional (2D) ultrasonic elliptical vibratory turning (UEVT) offer unique advantages in improving material surface quality. Therefore, a novel laser ultrasonic elliptical vibratory turning (LUEVT) machining technique is proposed to improve the machining of SiCp/Al composites with two different volume fractions. The effect of highfrequency intermittent machining on material processing was further investigated by adjusting the pulsed laser power. Finite element modelling was used to predict the machining state, surface roughness, and chip morphology between the workpiece and the PCD tool. The effects of varying the machining parameters during the experiment on the two composites were analysed. The results showed that the LUEVT of 25 % and 45 % SiCp/Al composites were reduced by 39.3 % and 30.7 % respectively compared to the CT cutting forces. The experiments verified the consistency of the surface roughness and chip morphology with the finite element simulation results. The stability of the cutting force during the cutting process is also improved, as the material removal process mainly takes the form of small particle fragmentation and matrix encapsulation.

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激光超声波椭圆振动车削 SiCp/Al 复合材料切削机理的有限元分析和实验研究

SiCp/Al 复合材料具有优异的材料性能，在航空航天、军事和电子封装行业的应用日益广泛。然而，传统车削（CT）的不均匀性和不导电性导致材料表面质量差、切削力大，严重阻碍了颗粒增强金属基复合材料的应用。激光辅助车削（LAT）的热软化特性和二维（2D）超声波椭圆振动车削（UEVT）的间歇切削特性在改善材料表面质量方面具有独特的优势。因此，我们提出了一种新型激光超声椭圆振动车削（LUEVT）加工技术，以改进两种不同体积分数的 SiCp/Al 复合材料的加工。通过调整脉冲激光功率，进一步研究了高频间歇加工对材料加工的影响。使用有限元模型预测了工件和 PCD 刀具之间的加工状态、表面粗糙度和切屑形态。分析了实验过程中改变加工参数对两种复合材料的影响。结果表明，与 CT 切削力相比，25 % 和 45 % SiCp/Al 复合材料的 LUEVT 分别降低了 39.3 % 和 30.7 %。实验验证了表面粗糙度和切屑形态与有限元模拟结果的一致性。切削过程中切削力的稳定性也得到了提高，因为材料去除过程主要以小颗粒破碎和基体包裹的形式进行。

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来源期刊

Materials Today Communications Materials Science-General Materials Science

CiteScore

5.20

自引率

5.30%

发文量

1783

审稿时长

51 days

期刊介绍： Materials Today Communications is a primary research journal covering all areas of materials science. The journal offers the materials community an innovative, efficient and flexible route for the publication of original research which has not found the right home on first submission.