Saurabh Khuje, Abdullah Islam, Long Zhu, Jun Zhang, Zhongxuan Wang, Thomas Parker, Jian Yu, Shenqiang Ren
{"title":"Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling","authors":"Saurabh Khuje, Abdullah Islam, Long Zhu, Jun Zhang, Zhongxuan Wang, Thomas Parker, Jian Yu, Shenqiang Ren","doi":"10.1021/acsaelm.4c01259","DOIUrl":null,"url":null,"abstract":"Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable <i>in situ</i> conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2024-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsaelm.4c01259","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Oxidation and corrosion present significant challenges for copper in critical applications such as electronics. Graphene-like carbon materials hold promise for preventing oxidation and corrosion, but their application to metallic surfaces is hindered by a complex immobilization process. Herein, we describe copper-based molecular decomposable inks derived from recycling which enable in situ conversion to form a copper─graphitic carbon hierarchical structure. This structure withstands severe corrosive and oxidative environments and maintains stable performance across a wide temperature range, from cryogenic (−193 °C) to high temperature (500 °C) conditions. The graphitic carbon shell acts as an effective barrier, preventing oxidation and corrosion by creating lengthy diffusion routes within the hierarchical copper matrix. This enables the reliable operation of a printed antenna under a corrosive environment in a reliable fashion. The results show that the copper with a graphitic carbon shell has excellent oxidation and corrosion resistance capabilities, and the findings can be expanded to establish printed molecular decomposable materials as a platform for rapid prototyping of anticorrosion and antioxidation electronics suitable for different environmental conditions.