{"title":"Promotion on the thermal and mechanical behaviors of epoxy resin using phthalonitrile and functionalized‐SiO2","authors":"Shouhui Wu, Cong Peng, Zhanjun Wua","doi":"10.1002/pat.6579","DOIUrl":null,"url":null,"abstract":"The phenolic‐type phthalonitrile (PN) was added to EP/DDM system in order to enhance the thermal and mechanical performance at high temperature. The influence of the added PN on the curing process of EP/DDM was studied via DSC and the activating energy (<jats:italic>E</jats:italic><jats:sub>α</jats:sub>) was calculated based on iso‐conversional method. The <jats:italic>E</jats:italic><jats:sub>α</jats:sub> values corresponding to EP/DDM crosslink reaction remained at about 60 kJ mol<jats:sup>−1</jats:sup> while it dramatically increased to 68.2 kJ mol<jats:sup>−1</jats:sup> when PN content reached 50 wt% (EP‐PN50). The <jats:italic>T</jats:italic><jats:sub>g</jats:sub> and char yield at 700°C in N<jats:sub>2</jats:sub> increased from141°C, 25.7%, for the neat EP/DDM to 226°C, 68.7% for the EP‐PN50. The measured char yields of the cured blend were higher than the calculated values which implies the interaction between EP/DDM and polyphthalonitrile network. The tensile and bending tests were carried out at 413 K and the modulus of EP‐PN50 remains 2.3 Gpa. On the meantime, the cyano‐functionalized SiO<jats:sub>2</jats:sub> (CNSiO<jats:sub>2</jats:sub>) was prepared to further promote the mechanical behaviors of this resin blend in high temperature. The contact angles of raw SiO<jats:sub>2</jats:sub>, KH560SiO<jats:sub>2</jats:sub>, CNSiO<jats:sub>2</jats:sub> with EP‐PN50 are 59.3, 52.6, 49.7°, respectively, which confirms the better wettability of CNSiO<jats:sub>2</jats:sub> to the EP/PN blend. Furthermore, the tensile and bending tests conducted at 413 K confirmed that the CNSiO<jats:sub>2</jats:sub> was more efficient on enhancing the mechanical performance of this EP/DDM/PN system at high temperature.","PeriodicalId":20382,"journal":{"name":"Polymers for Advanced Technologies","volume":null,"pages":null},"PeriodicalIF":3.1000,"publicationDate":"2024-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymers for Advanced Technologies","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1002/pat.6579","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
The phenolic‐type phthalonitrile (PN) was added to EP/DDM system in order to enhance the thermal and mechanical performance at high temperature. The influence of the added PN on the curing process of EP/DDM was studied via DSC and the activating energy (Eα) was calculated based on iso‐conversional method. The Eα values corresponding to EP/DDM crosslink reaction remained at about 60 kJ mol−1 while it dramatically increased to 68.2 kJ mol−1 when PN content reached 50 wt% (EP‐PN50). The Tg and char yield at 700°C in N2 increased from141°C, 25.7%, for the neat EP/DDM to 226°C, 68.7% for the EP‐PN50. The measured char yields of the cured blend were higher than the calculated values which implies the interaction between EP/DDM and polyphthalonitrile network. The tensile and bending tests were carried out at 413 K and the modulus of EP‐PN50 remains 2.3 Gpa. On the meantime, the cyano‐functionalized SiO2 (CNSiO2) was prepared to further promote the mechanical behaviors of this resin blend in high temperature. The contact angles of raw SiO2, KH560SiO2, CNSiO2 with EP‐PN50 are 59.3, 52.6, 49.7°, respectively, which confirms the better wettability of CNSiO2 to the EP/PN blend. Furthermore, the tensile and bending tests conducted at 413 K confirmed that the CNSiO2 was more efficient on enhancing the mechanical performance of this EP/DDM/PN system at high temperature.
期刊介绍:
Polymers for Advanced Technologies is published in response to recent significant changes in the patterns of materials research and development. Worldwide attention has been focused on the critical importance of materials in the creation of new devices and systems. It is now recognized that materials are often the limiting factor in bringing a new technical concept to fruition and that polymers are often the materials of choice in these demanding applications. A significant portion of the polymer research ongoing in the world is directly or indirectly related to the solution of complex, interdisciplinary problems whose successful resolution is necessary for achievement of broad system objectives.
Polymers for Advanced Technologies is focused to the interest of scientists and engineers from academia and industry who are participating in these new areas of polymer research and development. It is the intent of this journal to impact the polymer related advanced technologies to meet the challenge of the twenty-first century.
Polymers for Advanced Technologies aims at encouraging innovation, invention, imagination and creativity by providing a broad interdisciplinary platform for the presentation of new research and development concepts, theories and results which reflect the changing image and pace of modern polymer science and technology.
Polymers for Advanced Technologies aims at becoming the central organ of the new multi-disciplinary polymer oriented materials science of the highest scientific standards. It will publish original research papers on finished studies; communications limited to five typewritten pages plus three illustrations, containing experimental details; review articles of up to 40 pages; letters to the editor and book reviews. Review articles will normally be published by invitation. The Editor-in-Chief welcomes suggestions for reviews.