Fluidized Bed Chemical Vapor Deposition of Copper on Micronic Alumina Powders

IF 1.8 4区 工程技术 Q3 ENGINEERING, CHEMICAL
Ilyass Jellal, Hugues Vergnes, Brigitte Caussat
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Abstract

Uniformly coating micronic particles with metals is of main interest for a broad range of applications. This study demonstrates the feasibility of depositing pure copper on the surface of micronic alumina particles by the fluidized bed chemical vapor deposition process from the cheap and nontoxic copper acetylacetonate precursor. Thanks to the development of a preconditioning protocol, a complete fluidization of the particles organized as porous agglomerates was reached. The coating of the individual particles was favored by using conditions involving low deposition rates. The influence of key operating parameters on the process behavior and on the characteristics of the deposit was studied. The deposited copper was of cubic crystal structure without carbon nor oxide contamination.

Abstract Image

流化床化学气相沉积微氧化铝粉末上的铜
在微米颗粒上均匀地涂覆金属是广泛应用的主要兴趣所在。本研究证明了通过流化床化学气相沉积工艺在微米氧化铝颗粒表面沉积纯铜的可行性,该工艺的前驱体为廉价且无毒的乙酰丙酮铜。由于开发了一种预处理方案,以多孔团聚体形式组织的颗粒实现了完全流化。在低沉积速率的条件下,有利于单个颗粒的涂层。研究了关键操作参数对工艺行为和沉积特性的影响。沉积的铜为立方晶体结构,没有碳或氧化物污染。
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来源期刊
Chemical Engineering & Technology
Chemical Engineering & Technology 工程技术-工程:化工
CiteScore
3.80
自引率
4.80%
发文量
315
审稿时长
5.5 months
期刊介绍: This is the journal for chemical engineers looking for first-hand information in all areas of chemical and process engineering. Chemical Engineering & Technology is: Competent with contributions written and refereed by outstanding professionals from around the world. Essential because it is an international forum for the exchange of ideas and experiences. Topical because its articles treat the very latest developments in the field.
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